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{{title|Die}}
 
{{title|Die}}
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[[File:ibm power9 die.jpg|right|thumb|IBM {{ibm|Power9|l=arch}} die.]]
 
A '''die''' is the actual IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product.
 
A '''die''' is the actual IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product.

Revision as of 23:53, 10 May 2020

IBM Power9 die.

A die is the actual IC chip and is the final product of the fabrication process. It is the individual chip made following the singulation of a wafer. Dies typically undergo packaging before being sold to the customer as a final product.

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