Semiconductor & Computer Engineering
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A '''chiplet''' is an [[integrated circuit]] block that is part of a chip that consists of multiple such chiplets. In such chips, a system is subdivided into functional circuit blocks, called "chiplets", that are often reusable IP blocks. | A '''chiplet''' is an [[integrated circuit]] block that is part of a chip that consists of multiple such chiplets. In such chips, a system is subdivided into functional circuit blocks, called "chiplets", that are often reusable IP blocks. | ||
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| + | == Overview == | ||
| + | Chiplets refer to the independent constituents which make up a large chip built out of multiple smaller dies. Historically the need to go with multiple chips was driven by the [[reticle limit]] which dictated the maximum size of chip possible to be [[fabricated]]. Designs that exceeded the reticle limit had to be split up into smaller dies in order to be manufacturable. More recently, the desire to move to a chiplet-based designed has been driven by the increasing cost of manufacturing devices on leading-edge process nodes. Due to the cost associated with leading-edge nodes, it became advantageous to break down a large die into smaller 'chiplets' in order to improve [[yield]] and [[binning]]. | ||
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Revision as of 13:01, 28 January 2019
A chiplet is an integrated circuit block that is part of a chip that consists of multiple such chiplets. In such chips, a system is subdivided into functional circuit blocks, called "chiplets", that are often reusable IP blocks.
Overview
Chiplets refer to the independent constituents which make up a large chip built out of multiple smaller dies. Historically the need to go with multiple chips was driven by the reticle limit which dictated the maximum size of chip possible to be fabricated. Designs that exceeded the reticle limit had to be split up into smaller dies in order to be manufacturable. More recently, the desire to move to a chiplet-based designed has been driven by the increasing cost of manufacturing devices on leading-edge process nodes. Due to the cost associated with leading-edge nodes, it became advantageous to break down a large die into smaller 'chiplets' in order to improve yield and binning.
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