From WikiChip
Difference between revisions of "arm holdings/microarchitectures/cortex-a72"
< arm holdings

(Bibliography)
Line 40: Line 40:
  
 
== Bibliography ==
 
== Bibliography ==
* Pyo, Jungyul, et al. "23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015
+
* Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.

Revision as of 13:49, 29 December 2018

Edit Values
Cortex-A72 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerTSMC
IntroductionApril 23, 2015
Succession

Cortex-A72 (codename Maya) is the successor to the Cortex-A57, a low-power high-performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as a synthesizable IP core and is sold to other semiconductor companies to be implemented in their own chips. The Cortex-A72, which implemented the ARMv8 ISA, is the a performant core which is often combined with a number of lower power cores (e.g. Cortex-A53) in a big.LITTLE configuration to achieve better energy/performance.

Architecture

Key changes from Cortex-A57

New text document.svg This section is empty; you can help add the missing info by editing this page.

Block Diagram

New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory Hierarchy

New text document.svg This section is empty; you can help add the missing info by editing this page.

Die

MediaTek Helio X20

  • TSMC 20 nm process
  • 100 mm² die size
  • Quad-core ULP Cortex-A53
    • ~21.81 mm² per cluster
      • ~4.23 mm² per core
  • Quad-core efficient Cortex-A53
    • ~29.73 mm² per cluster
      • ~5.41 mm² per core
  • Dual-core High-performance Cortex-A72 + 1 MiB L2
    • ~27.36 mm² per cluster
      • ~ 9.60 mm² per core
      • ~ 7.50 mm² for 1 MiB L2


mt6797 die.png

Bibliography

  • Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
codenameCortex-A72 +
designerARM Holdings +
first launchedApril 23, 2015 +
full page namearm holdings/microarchitectures/cortex-a72 +
instance ofmicroarchitecture +
manufacturerTSMC +
microarchitecture typeCPU +
nameCortex-A72 +