From WikiChip
Difference between revisions of "arm holdings/microarchitectures/cortex-a57"
< arm holdings

(Samsung Exynos 5433)
Line 60: Line 60:
 
* 113 mm² die size
 
* 113 mm² die size
 
* Mali-T760 (6 EU)
 
* Mali-T760 (6 EU)
* Quad-core {{\\|Cortex-A53}} ([[small cores]])
+
* Quad-core {{\\|Primary Cortex-A57 [Quad] + Secondary A53 [Quad]}}
 
** 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
 
** 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
 
** 4.4 mm² per cluster
 
** 4.4 mm² per cluster

Revision as of 06:42, 24 November 2020

Edit Values
Cortex-A57 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerTSMC
IntroductionOct 30, 2012
Instructions
ISAARMv8
Succession

Cortex-A57 (codename Atlas) is the successor to the Cortex-A15, a low-power high-performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as a synthesizable IP core and is sold to other semiconductor companies to be implemented in their own chips. The Cortex-A57, which implemented the ARMv8 ISA, is the a performant core which is often combined with a number of lower power cores (e.g. Cortex-A53) in a big.LITTLE configuration to achieve better energy/performance.

Compiler support

Compiler Arch-Specific Arch-Favorable
Arm Compiler -mcpu=cortex-a57 -mtune=cortex-a57
GCC -mcpu=cortex-a57 -mtune=cortex-a57
LLVM -mcpu=cortex-a57 -mtune=cortex-a57

If the Cortex-A57 is coupled with the Cortex-A53 in a big.LITTLE system, GCC also supports the following option:

Compiler Tune
GCC -mtune=cortex-a57.cortex-a53

Architecture

Key changes from Cortex-A15

New text document.svg This section is empty; you can help add the missing info by editing this page.

Block Diagram

New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory Hierarchy

New text document.svg This section is empty; you can help add the missing info by editing this page.

Die

Cortex-A57 Clusters Silicon Areas (Estimated)
CompanySamsungRenesas
ChipExynos 5433R-Car H3
Process20 nm16 nm
Configuration4x Cortex-A57
+ 2 MiB L2
4x Cortex-A57
+ 2 MiB L2
Cluster Size~15.85 mm²~10.21 mm² cluster
Core Size~3 mm²~1.66 mm² cluster
Cache Size~3.87 mm²~3.28 mm² cluster

20 nm

Samsung Exynos 5433

  • Samsung 20 nm process
  • 113 mm² die size
  • Mali-T760 (6 EU)
  • Quad-core [[arm holdings/microarchitectures/primary cortex-a57 [quad] + secondary a53 [quad]#|Primary Cortex-A57 [Quad] + Secondary A53 [Quad]]]
    • 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
    • 4.4 mm² per cluster
      • ~1 mm² per core
      • ~0.55 mm² for 256 KiB L2 cache
  • Quad-core Cortex-A57 (big cores)
    • 48KB L1I$ and 32KB L1D$ per core, and a shared 2 MiB L2
    • 15.85 mm² per cluster
      • ~3 mm² per core
      • ~3.87 mm² for 2 MiB L2 cache


exynos 5433 die.png

16 nm

Renesas R-Car H3

  • TSMC 16 nm process
  • 12.94 mm × 8.61 mm
  • 111.36 mm² die size
  • Quad-core Cortex-A53
    • ~3.27 mm² cluster
    • ~0.60 mm² core
    • ~0.7 mm² 512 KiB L2 cache
  • Quad-core Cortex-A57
    • ~10.21 mm² cluster
    • ~1.66 mm² core
    • ~3.28 mm² 2 MiB L2 cache
  • Cortex-R7 (dual-core lock-step)
    • ~1.04 mm² cluster
  • GX6650 GPU
    • ~28.12 mm²


r-car h3 die shot.png


A57 Cluster:

h3 a57 cluster.png

Bibliography

  • Pyo, Jungyul, et al. "23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015
codenameCortex-A57 +
designerARM Holdings +
first launchedOctober 30, 2012 +
full page namearm holdings/microarchitectures/cortex-a57 +
instance ofmicroarchitecture +
instruction set architectureARMv8 +
manufacturerTSMC +
microarchitecture typeCPU +
nameCortex-A57 +