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Revision as of 15:18, 11 August 2018

Edit Values
Socket SP3
General Info
DesignerAMD
IntroductionMay 16, 2017 (announced)
June 20, 2017 (launched)
MarketDesktop
MicroarchitectureZen
TDP120 W
120,000 mW
0.161 hp
0.12 kW
, 155 W
155,000 mW
0.208 hp
0.155 kW
, 180 W
180,000 mW
0.241 hp
0.18 kW
Package
NameFCLGA-4094
TypeOrganic Flip-Chip Land Grid Array
Contacts4094
Dimension58.5 mm
5.85 cm
2.303 in
× 75.4 mm
7.54 cm
2.969 in
Pitch1.00 mm
0.0394 in
Socket
NameSocket SP3,
LGA-4094
TypeLGA

Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.

Overview

SP3 is a socket specifically designed by AMD for their EPYC family of server processors and is supported by processors based on the Zen microarchitectures. Physically, the package is identical to the one used for Socket TR4 for their Threadripper processors, however, the features are very different.

sp3-details.png

Supported Processors

Bibliography

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Facts about "Socket SP3 - Packages - AMD"
RDF feed
designerAMD +
first announcedMay 16, 2017 +
first launchedJune 20, 2017 +
instance ofpackage +
market segmentDesktop +
microarchitectureZen +
nameSocket SP3 +
packageFCLGA-4094 +
package contacts4,094 +
package length58.5 mm (5.85 cm, 2.303 in) +
package pitch1 mm (0.0394 in) +
package typeOrganic Flip-Chip Land Grid Array +
package width75.4 mm (7.54 cm, 2.969 in) +
socketSocket SP3 + and LGA-4094 +
tdp120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) +