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designerAMD +
first announcedMay 16, 2017 +
first launchedJune 20, 2017 +
instance ofpackage +
market segmentServer +
microarchitectureZen +, Zen 2 + and Zen 3 +
nameSocket SP3 +
packageSP3 + and FCLGA-4094 +
package contacts4,094 +
package height6.26 mm (0.246 in) +
package length75.4 mm (7.54 cm, 2.969 in) +
package pitch0.87 mm (0.0343 in) + and 1 mm (0.0394 in) +
package typeFC-OLGA +
package width58.5 mm (5.85 cm, 2.303 in) +
socketSP3 + and LGA-4094 +
tdp120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) +