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Socket S1g4 - AMD
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Socket S1g4
General Info
DesignerAMD
IntroductionMay 12, 2010 (launched)
MarketMobile
MicroarchitectureK10
TDP45 W
45,000 mW
0.0603 hp
0.045 kW
Package
NameOPGA-638
TypeOrganic Micro Pin Grid Array
Contacts638
Dimension35.0 mm
3.5 cm
1.378 in
× 35.0 mm
3.5 cm
1.378 in
Pitch1.27 mm
0.05 in
Socket
NameSocket S1g4
TypePGA

Socket S1g4 was the fourth and last socket for OPGA-638-packaged AMD mobile microprocessors with an integrated DDR2 and DDR3 memory controller, and the successor to Socket S1g3. Its counterparts for desktop processors are Socket AM3 and Socket AM3+, for servers Socket C32 and Socket G34. For the small form factor desktop, mobile and embedded market AMD developed package ASB2. Socket S1g4 was superseded by Socket FS1 supporting mobile processors with integrated graphics.

The main improvement of Socket S1g4 over S1g3 is support for DDR3 memory. As the number of CPU cores in the package grew to three and four, voltage regulators were integrated on the chip and support for two core power planes was dropped.

Socket S1g4 was used in AMD's "Danube" mobile platform. All processors for Socket S1g4, codename "Champlain", are members of AMD's Family 10h with CPU cores based on the K10 microarchitecture and were fabricated on a 45 nm SOI process.

All revisions of Socket S1 have the same dimensions, however processors for Socket S1g4 appear to be electrically incompatible with Socket S1g1 and vice versa. Processors for Socket S1g2 have a DDR2 memory controller and will not work in Socket S1g4. To which extent Socket S1g4 processors are compatible with Socket S1g2 and S1g3, in DDR2 mode and with a suitable BIOS, is unclear.

Features

  • 638-pin lidless micro pin grid array package, 1.27 mm pitch, 26 × 26 pins, 35 × 35 mm, organic substrate, C4 (flip chip) die attachment
  • 16 bit HyperTransport 3.0 interface up to 1800 MHz, 3600 MT/s, 7.2 GB/s in each direction
  • 2 × 64 bit DDR2 SDRAM interface up to 400 MHz, PC2-6400 (DDR2-800), 12.8 GB/s or
  • 2 × 64 bit DDR3 SDRAM interface up to 667 MHz, PC3-10600 (DDR3-1333), 21.3 GB/s
    • Up to 2 SODIMMs, no ECC support
    • DDR2 JEDEC SSTL_1.8, DDR3 JEDEC 1.5V, 1.35V
  • Power Management
    • AMD PowerNow! technology
    • ACPI C1, C1E, C2, C3, C5/Altvid, S1, S3, S4, S5
    • Separate core and northbridge power planes
    • Two northbrige P-states

Chipsets

  • AMD 880M
  • AMD SB820 southbridge

Processors using Socket S1g4

  • AMD Phenom II Quad-Core Mobile
  • AMD Phenom II Triple-Core Mobile
  • AMD Phenom II Dual-Core Mobile
  • AMD Turion II Dual-Core Mobile
  • AMD Athlon II Dual-Core Mobile
  • AMD V-Series
 List of all Socket S1g4-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram

No data available. Dimensions should be similar to those of the OPGA-638 package shown on the Socket S1g1 page.

Socket Outline

Socket S1 diag.svg

Socket S1 limits as specified in AMD Publ. #31839. Depicted is Foxconn Interconnect Technology Part No. PZ6382A-284S-01F. All dimensions in millimeters.

Pin Map

Socket S1g4 pinmap.svg

Differences between Socket S1 revisions

Pin S1g1 S1g2/S1g3 S1g4 Description
R21 MA_ADD[0] MA_ADD[10] MA_ADD[10] DRAM Column/Row Address
N21 MA_ADD[1] MA_ADD[0] MA_ADD[0]
M22 MA_ADD[3] MA_ADD[4] MA_ADD[4]
M24 MA_ADD[4] MA_ADD[6] MA_ADD[6]
M20 MA_ADD[5] MA_ADD[1] MA_ADD[1]
M19 MA_ADD[6] MA_ADD[3] MA_ADD[3]
L22 MA_ADD[8] MA_ADD[11] MA_ADD[11]
L19 MA_ADD[9] MA_ADD[8] MA_ADD[8]
R19 MA_ADD[10] MA_RAS_L MA_RAS_L
L20 MA_ADD[11] MA_ADD[5] MA_ADD[5]
K24 MA_ADD[12] MA_ADD[14] MA_ADD[14]
K20 MA_ADD[14] MA_ADD[12] MA_ADD[12]
T22 MA_BANK[0] MA_CAS_L MA_CAS_L DRAM Bank Address / Column Address Strobe
R20 MA_BANK[1] MA_BANK[0] MA_BANK[0]
R23 RSVD MA_BANK[1] MA_BANK[1]
K22 MA_BANK[2] MA_ADD[9] MA_ADD[9]
U20 MA_CAS_L MA1_CS_L[0] MA1_CS_L[0] DRAM Column Address Strobe / Chip Select
J21 MA_CKE[0] MA_BANK[2] MA_BANK[2] DRAM Clock Enable / Bank Address
T20 MA_RAS_L MA0_CS_L[0] MA0_CS_L[0] DRAM Row Address Strobe / Chip Select
U21 MA_WE_L MA1_ODT[0] MA1_ODT[0] DRAM Write Enable / Enable Pin for On Die Termination
E16 MA0_CLK_H[1] MA_CLK_H[1] MA_CLK_H[1] DRAM Differential Clock
F16 MA0_CLK_L[1] MA_CLK_L[1] MA_CLK_L[1]
P19 RSVD MA_CLK_H[4] MA_CLK_H[4]
P20 RSVD MA_CLK_L[4] MA_CLK_L[4]
N19 RSVD MA_CLK_H[5] MA_CLK_H[5]
N20 RSVD MA_CLK_L[5] MA_CLK_L[5]
Y16 MA0_CLK_H[2] MA_CLK_H[7] MA_CLK_H[7]
AA16 MA0_CLK_L[2] MA_CLK_L[7] MA_CLK_L[7]
T19 MA0_CS_L[0] MA0_ODT[0] MA0_ODT[0]
V22 MA0_CS_L[1] MA0_ODT[1] MA0_ODT[1]
J22 MA0_CS_L[2] MA_CKE[0] MA_CKE[0]
V19 MA0_CS_L[3] MA1_ODT[1] MA1_ODT[1]
U19 MA0_ODT[0] MA0_CS_L[1] MA0_CS_L[1]
V20 MA0_ODT[1] MA1_CS_L[1] MA1_CS_L[1]
H16 RSVD RSVD_M1 MA_RESET_L DRAM Reset Pin for Suspend-to-RAM Power Management Mode
T24 MB_ADD[0] MA_WE_L MA_WE_L
P26 MB_ADD[1] MB_ADD[2] MB_ADD[2]
P24 MB_ADD[2] MB_ADD[0] MB_ADD[0]
N26 MB_ADD[3] MB_ADD[4] MB_ADD[4]
N25 MB_ADD[4] MB_ADD[6] MB_ADD[6]
N24 MB_ADD[5] MB_ADD[1] MB_ADD[1]
N23 MB_ADD[6] MB_ADD[3] MB_ADD[3]
L26 MB_ADD[7] MB_ADD[11] MB_ADD[11]
L24 MB_ADD[9] MB_ADD[7] MB_ADD[7]
U25 MB_ADD[10] MB_RAS_L MB_RAS_L
L25 MB_ADD[11] MB_ADD[12] MB_ADD[12]
L23 MB_ADD[12] MB_ADD[5] MB_ADD[5]
W25 MB_ADD[13] MB0_CS_L[1] MB0_CS_L[1]
J26 MB_ADD[14] MB_BANK[2] MB_BANK[2]
J25 MB_ADD[15] MB_CKE[0] MB_CKE[0]
R24 RSVD MB_BANK[0] MB_BANK[0]
U26 MB_BANK[0] MB_BANK[1] MB_BANK[1]
T26 MB_BANK[1] MB_ADD[10] MB_ADD[10]
K26 MB_BANK[2] MB_ADD[9] MB_ADD[9]
V26 MB_CAS_L MB0_CS_L[0] MB0_CS_L[0]
J23 MB_CKE[0] MB_ADD[14] MB_ADD[14]
U24 MB_RAS_L MB_CAS_L MB_CAS_L
U22 MB_WE_L MB1_CS_L[0] MB1_CS_L[0]
A17 MB0_CLK_H[1] MB_CLK_H[1] MB_CLK_H[1]
A18 MB0_CLK_L[1] MB_CLK_L[1] MB_CLK_L[1]
R26 RSVD MB_CLK_H[4] MB_CLK_H[4]
R25 RSVD MB_CLK_L[4] MB_CLK_L[4]
P22 RSVD MB_CLK_H[5] MB_CLK_H[5]
R22 RSVD MB_CLK_L[5] MB_CLK_L[5]
AF18 MB0_CLK_H[2] MB_CLK_H[7] MB_CLK_H[7]
AF17 MB0_CLK_L[2] MB_CLK_L[7] MB_CLK_L[7]
U23 MB0_CS_L[0] MB_WE_L MB_WE_L
W24 MB0_CS_L[1] MB_ADD[13] MB_ADD[13]
J24 MB0_CS_L[2] MB_ADD[15] MB_ADD[15]
Y26 MB0_CS_L[3] MB1_ODT[0] MB1_ODT[0]
B18 RSVD RSVD_M2 MB_RESET_L
AA8 RSVD MEMHOT_L MEMHOT_L DRAM Thermal Protection input
A3 PSI_L RSVD RSVD Power Status Indicator (low power mode) for VDD regulator
W8 TEST4 THERMDA THERMDA Thermal Diode, Anode
W7 TEST5 THERMDC THERMDC Thermal Diode, Cathode
AA7 TEST13 RSVD RSVD
AE6 TEST26 ALERT_L ALERT_L Programmable pin that can indicate different events, including a SB-TSI interrupt
M11 VSS KEY1 VSS
W18 RSVD KEY2 RSVD
misc. VDD VDD0 VDD Core power supply
F6 VDD_FB_H VDD0_FB_H VDD0_FB_H Differential feedback to VDD0 regulator
E6 VDD_FB_L VDD0_FB_L VDD0_FB_L
misc. VDD VDD1 VDD
Y6 TEST3 VDD1_FB_H VDD1_FB_H Differential feedback to VDD1 regulator
AB6 TEST2 VDD1_FB_L VDD1_FB_L
misc. VDD VDDNB VDDNB Northbridge power supply
H6 RSVD VDDNB_FB_H VDDNB_FB_H Differential feedback to VDDNB regulator
G6 RSVD VDDNB_FB_L VDDNB_FB_L
B5 VID[0] RSVD RSVD Voltage ID for VDD regulator
C5 VID[1] RSVD RSVD
A4 VID[2] SVD SVD Serial Voltage ID Interface, Data
A6 VID[3] SVC SVC Serial Voltage ID Interface, Clock
C6 VID[4] LDTREQ_L LDTREQ_L HT link is active or requested by a device (HT Gen 3.0)
A5 VID[5] RSVD RSVD
misc. VTT VTT VDDR
Y10 VTT_SENSE VTT_SENSE VDDR_SENSE VTT / VDDR monitor pin

References

See also

Facts about "Socket S1g4 - AMD"
designerAMD +
first launchedMay 12, 2010 +
instance ofpackage +
market segmentMobile +
microarchitectureK10 +
nameSocket S1g4 +
packageOPGA-638 +
package contacts638 +
package length35 mm (3.5 cm, 1.378 in) +
package pitch1.27 mm (0.05 in) +
package typeOrganic Micro Pin Grid Array +
package width35 mm (3.5 cm, 1.378 in) +
socketSocket S1g4 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +