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Revision history of "amd/packages/ft3b"
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Retrieved from "https://en.wikichip.org/wiki/amd/packages/ft3b"
Facts about "Package FT3b - AMD"
| designer | AMD + |
| first launched | June 4, 2014 + |
| instance of | package + |
| market segment | Mobile + and Embedded + |
| microarchitecture | Puma + |
| name | FT3b + |
| package | BGA-769 + |
| package contacts | 769 + |
| package length | 24.5 mm (2.45 cm, 0.965 in) + |
| package pitch | 0.65 mm (0.0256 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 24.5 mm (2.45 cm, 0.965 in) + |
| tdp | 25 W (25,000 mW, 0.0335 hp, 0.025 kW) + |
