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Facts about "Package FT1 - AMD"
designerAMD +
first launchedJanuary 4, 2011 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureBobcat +
nameFT1 +
packageFT1 + and UOB413 +
package contacts413 +
package height1.92 mm (0.0756 in) +
package length19 mm (1.9 cm, 0.748 in) +
package pitch0.8 mm (0.0315 in) +
package typeFC-OBGA +
package width19 mm (1.9 cm, 0.748 in) +
tdp18 W (18,000 mW, 0.0241 hp, 0.018 kW) +