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Facts about "Package FP5 - AMD"
designerAMD +
first launchedJanuary 8, 2018 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureZen + and Zen+ +
namePackage FP5 +
packageFP5 +
package contacts1,140 +
package length35 mm (3.5 cm, 1.378 in) +
package pitch0.7 mm (0.0276 in) +
package typeOrganic Micro Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +