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Facts about "Package FP4 - AMD"
designerAMD +
first launchedJune 2015 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureExcavator +
namePackage FP4 +
packageBGA-968 + and FP4 +
package contacts968 +
package length37 mm (3.7 cm, 1.457 in) +
package pitch0.8 mm (0.0315 in) +
package typeOrganic Micro Ball Grid Array +
package width29 mm (2.9 cm, 1.142 in) +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +