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Editing amd/packages/cbga-360 (section)

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designerAMD +
first launchedMarch 5, 1998 +
instance ofpackage +
market segmentMobile +
microarchitectureK6 +
namePackage CBGA-360 +
packageCBGA-360 +
package contacts360 +
package length25 mm (2.5 cm, 0.984 in) +
package pitch1.27 mm (0.05 in) +
package typeCeramic Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp11 W (11,000 mW, 0.0148 hp, 0.011 kW) +