|Zen 3 µarch|
Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the Zen microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize 7nm+ process.
|Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.|
|Milan||?/?||High-end server multiprocessors|
|Genesis Peak||?/?||Workstation & enthusiasts market processors|
|Vermeer||?/?||Mainstream to high-end desktops & enthusiasts market processors|
|Cezanne||?/?||Mainstream desktop & mobile processors with GPU|
Nothing is currently known about the architectural improvements that are being done for Zen 3.
Key changes from Zen 2
- 7 nm+ process (from 7 nm) , 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+.
- Unify 2 x 4 core CCX into 1 x 8 core CCX per CCD.
- Decrease memory latency.
This list is incomplete; you can help by expanding it.
- AMD 'Tech Day', February 22, 2017
- AMD 2017 Financial Analyst Day, May 16, 2017