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Athlon PRO 300GE - AMD
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Revision as of 12:43, 12 October 2019 by Oleg3280 (talk | contribs) (|microarch=Zen+ Athlon 300U Athlon PRO 300U Picasso (Athlon PRO 200GE was zen))

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Athlon PRO 300GE
General Info
DesignerAMD
ManufacturerGlobalFoundries
Model NumberPRO 300GE
Part NumberYD300BC6M2OFH
MarketDesktop
IntroductionSeptember 30, 2019 (announced)
September 30, 2019 (launched)
ShopAmazon
General Specs
FamilyAthlon
SeriesPRO 300
LockedYes
Frequency3,400 MHz
Clock multiplier34
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen+
ChipsetPromontory
Core NamePicasso
Process12 nm
Transistors4,950,000,000
TechnologyCMOS
Die209.78 mm²
Word Size64 bit
Cores2
Threads4
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP35 W
Packaging
Template:packages/amd/socket am4

Athlon PRO 300GE is a 64-bit dual-core low-end performance x86 workstation microprocessor introduced by AMD in late 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The PRO 300GE operates at a base frequency of 3.4 GHz with a TDP of 35 W. This MPU supports up to 64 GiB of dual-channel DDR4-2666 memory and incorporates Radeon Vega 3 Graphics operating at 1.1 GHz.

Cache

Main article: Zen § Cache

[Edit/Modify Cache Info]

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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$192 KiB
196,608 B
0.188 MiB
L1I$128 KiB
131,072 B
0.125 MiB
2x64 KiB4-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back

L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  2x512 KiB8-way set associativewrite-back

L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  1x4 MiB  

Memory controller

[Edit/Modify Memory Info]

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Integrated Memory Controller
Max TypeDDR4-2666
Supports ECCYes
Max Mem64 GiB
Controllers2
Channels2
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s
[Edit] Memory Configurations
Dual Channel Single Rank 2 of 2 DDR4-2933*
2 of 4 DDR4-2933*
4 of 4 DDR4-2133
Double Rank 2 of 2 DDR4-2667
2 of 4 DDR4-2400
4 of 4 DDR4-1866

Expansions

The 300GE includes 20 PCIe lanes - 16 for a DGP and 4 for storage (NVMe or 2 ports SATA Express).

[Edit/Modify Expansions Info]

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Expansion Options
PCIeRevision: 3.0
Max Lanes: 20
Configuration: 1x16+1x4, 2x8+1x4


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPURadeon Vega 3
DesignerAMD
Execution Units3
Unified Shaders192
Burst Frequency1,100 MHz
1.1 GHz
1,100,000 KHz
OutputDP, HDMI

Standards
DirectX12
OpenGL4.6
OpenCL2.2
Vulkan1.1

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
FMA44-Operand Fused-Multiply-Add
AESAES Encryption Instructions
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
SMTSimultaneous Multithreading
AMD-VAMD Virtualization
TSMETransparent SME
SenseMISenseMI Technology
Boost 2Precision Boost 2
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Athlon PRO 300GE - AMD#pcie +
base frequency3,400 MHz (3.4 GHz, 3,400,000 kHz) +
chipsetPromontory +
clock multiplier34 +
core count2 +
core namePicasso +
designerAMD +
die area209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
familyAthlon +
first announcedSeptember 30, 2019 +
first launchedSeptember 30, 2019 +
full page nameamd/athlon/pro 300ge +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd precision boost 2true +
has amd sensemi technologytrue +
has amd transparent secure memory encryption technologytrue +
has ecc memory supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, SenseMI Technology + and Precision Boost 2 +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 3 +
integrated gpu designerAMD +
integrated gpu execution units3 +
integrated gpu max frequency1,100 MHz (1.1 GHz, 1,100,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size192 KiB (196,608 B, 0.188 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description4-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateSeptember 30, 2019 +
manufacturerGlobalFoundries +
market segmentDesktop +
max cpu count1 +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureZen+ +
model numberPRO 300GE +
nameAthlon PRO 300GE +
part numberYD300BC6M2OFH +
process12 nm (0.012 μm, 1.2e-5 mm) +
seriesPRO 300 +
smp max ways1 +
supported memory typeDDR4-2666 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
transistor count4,950,000,000 +
word size64 bit (8 octets, 16 nibbles) +