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Facts about "Package SP4 - AMD"
designerAMD +
first launchedFebruary 21, 2018 +
instance ofpackage +
market segmentEmbedded +
microarchitectureZen +
nameSP4 +
packageSP4 +
package length45 mm (4.5 cm, 1.772 in) +
package pitch0.8 mm (0.0315 in) +
package typeFC-OBGA +
package width45 mm (4.5 cm, 1.772 in) +
tdp100 W (100,000 mW, 0.134 hp, 0.1 kW) +