Revision history of "amd/packages/fp6"

Diff selection: Mark the radio boxes of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.

(cur | prev) 17:47, 10 May 2023‎ QuietRub (talk | contribs)‎ . . (20,312 bytes) (+498)‎ . . (→‎Processors using package FP6: More blue text and checkmarks.) (undo)
(cur | prev) 09:02, 9 May 2023‎ QuietRub (talk | contribs)‎ . . (19,814 bytes) (+751)‎ . . (Added pinout.) (undo)
(cur | prev) 15:58, 23 April 2022‎ QuietRub (talk | contribs)‎ . . (19,063 bytes) (+14,508)‎ . . (Update.) (undo)
(cur | prev) 13:48, 25 May 2021‎ QuietRub (talk | contribs)‎ . . (4,555 bytes) (+484)‎ . . (Lucienne / Cezanne update.) (undo)
(cur | prev) 14:24, 7 January 2021‎ QuietRub (talk | contribs)‎ . . (4,071 bytes) (+157)‎ . . (Added package diagram.) (undo)
(cur | prev) 03:53, 2 January 2021‎ QuietRub (talk | contribs)‎ . . (3,914 bytes) (+3,914)‎ . . (Created page with "{{amd title|Package FP6}} {{package |name=Package FP6 |designer=AMD |market=Mobile |market 2=Embedded |first launched=March 16, 2020 |microarch=Zen 2 |tdp=55 W |package name=B...")

designer	AMD +
first launched	March 16, 2020 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Zen 2 + and Zen 3 +
name	Package FP6 +
package	FP6 +
package contacts	1,140 +
package height	1.38 mm (0.0543 in) +
package length	35 mm (3.5 cm, 1.378 in) +
package pitch	0.65 mm (0.0256 in) +
package type	FC-OBGA +
package width	25 mm (2.5 cm, 0.984 in) +
tdp	55 W (55,000 mW, 0.0738 hp, 0.055 kW) +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung