From WikiChip
Package FP5 - AMD
< amd

Edit Values
Package FP5
General Info
DesignerAMD
IntroductionJanuary 8, 2018 (launched)
MarketMobile, Embedded
MicroarchitectureZen, Zen+
TDP45 W
45,000 mW
0.0603 hp
0.045 kW
Package
NameFP5
TypeOrganic Micro Ball Grid Array
Contacts1140
Dimension35 mm
3.5 cm
1.378 in
× 25 mm
2.5 cm
0.984 in
Pitch0.7 mm
0.0276 in

FP5 is a BGA-1140 package for AMD mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub targeting the notebook and embedded market. Its counterpart for desktop processors is the PGA-1331 package for Socket AM4. FP5 is the successor to the FP4 package and was superseded by the FP6 package.

All processors in the FP5 package, codename "Raven Ridge", "Great Horned Owl", "Banded Kestrel", "Picasso", and "Dali", are members of AMD's Family 17h with CPU cores based on the Zen and Zen+ microarchitecture, and are fabricated on 12 and 14 nm SOI processes.


Features

  • 1140-pin lidless micro ball grid array package, 0.7-1.0 mm multi-pitch, 35 × 25 mm, organic substrate
  • 2 × 64/72 bit DDR4 SDRAM interface up to 1600 MHz, PC4-25600 (DDR4-3200), 51.2 GB/s
    • Up to 2 SR/DR UDIMMs or SODIMMs (1 per channel), ECC supported
    • Up to 32 GiB total
  • PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
    • Configurable x8 external graphics card link
    • Configurable x8 General Purpose Ports (x4, x2, x1, NVMe, SATA, GbE)
  • Up to four independent display controllers
    • Four single link Digital Display Interfaces, two multiplexed with one USB 3.1 Type-C port each
    • DisplayPort 1.4 up to 3840 × 2160 at 120 Hz, DP++, DP Audio
    • HDMI 2.0b up to 4096 × 2160 at 60 Hz
    • eDP 1.4 up to 4096 × 2160
  • Integrated Controller Hub
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s), Type-C, DisplayPort Alternate Mode, Power Delivery capable
    • 2 × USB 1.1, 2.0, 3.1 (10 Gb/s)
    • 1 × USB 1.1, 2.0, 3.0 (5 Gb/s)
    • 1 × USB 1.1, 2.0
    • 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s) or 1 × SATA Express, each port multiplexed with one (SATA Express two) x1 GPP lane
    • 2 × 1/2.5/10 Gigabit Ethernet, multiplexed with GPP
    • eMMC 5.0, SD/SDIO 3.0/4.0, 2 × UART, 4 × I2C, 2 × SMBus, LPC, SPI/eSPI, I2S/HDA/SW, Serial IRQ, GPIO

Note some processor models support only a subset of these features.

Processors using package FP5

  • AMD Ryzen 3/5/7 Mobile Processor
  • AMD Athlon 3000 Series Mobile Processor
  • AMD Ryzen Embedded V1000 Series
  • AMD Ryzen Embedded R1000 Series
 List of all FP5-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
300U14 nm
0.014 μm
1.4e-5 mm
6 January 2019ZenAthlonPicasso242.4 GHz
2,400 MHz
2,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3150U14 nm
0.014 μm
1.4e-5 mm
6 January 2020ZenAthlon GoldDali242.4 GHz
2,400 MHz
2,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 300U12 nm
0.012 μm
1.2e-5 mm
8 April 2019Zen+AthlonPicasso242.4 GHz
2,400 MHz
2,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3050U14 nm
0.014 μm
1.4e-5 mm
6 January 2020ZenAthlon SilverDali222.3 GHz
2,300 MHz
2,300,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2200U14 nm
0.014 μm
1.4e-5 mm
8 January 2018ZenRyzen 3Raven Ridge242.5 GHz
2,500 MHz
2,500,000 kHz
3.4 GHz
3,400 MHz
3,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2300U14 nm
0.014 μm
1.4e-5 mm
8 January 2018ZenRyzen 3Raven Ridge442 GHz
2,000 MHz
2,000,000 kHz
3.4 GHz
3,400 MHz
3,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3200U12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 3Picasso242.6 GHz
2,600 MHz
2,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3250U14 nm
0.014 μm
1.4e-5 mm
6 January 2020ZenRyzen 3Dali242.6 GHz
2,600 MHz
2,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3300U12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 3Picasso442.1 GHz
2,100 MHz
2,100,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 2300U14 nm
0.014 μm
1.4e-5 mm
8 January 2018ZenRyzen 3Raven Ridge442 GHz
2,000 MHz
2,000,000 kHz
3.4 GHz
3,400 MHz
3,400,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 3300U12 nm
0.012 μm
1.2e-5 mm
8 April 2019Zen+Ryzen 3Picasso442.1 GHz
2,100 MHz
2,100,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2500U14 nm
0.014 μm
1.4e-5 mm
26 October 2017ZenRyzen 5Raven Ridge482 GHz
2,000 MHz
2,000,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2600H14 nm
0.014 μm
1.4e-5 mm
10 September 2018ZenRyzen 5Raven Ridge483.2 GHz
3,200 MHz
3,200,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
45 W
45,000 mW
0.0603 hp
0.045 kW
3500U12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 5Picasso482.1 GHz
2,100 MHz
2,100,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3550H12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 5Picasso482.1 GHz
2,100 MHz
2,100,000 kHz
35 W
35,000 mW
0.0469 hp
0.035 kW
3580U12 nm
0.012 μm
1.2e-5 mm
October 2019Zen+Ryzen 5Picasso482.1 GHz
2,100 MHz
2,100,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 2500U14 nm
0.014 μm
1.4e-5 mm
8 January 2018ZenRyzen 5Raven Ridge482 GHz
2,000 MHz
2,000,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 3500U12 nm
0.012 μm
1.2e-5 mm
8 April 2019Zen+Ryzen 5Picasso482.1 GHz
2,100 MHz
2,100,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2700U14 nm
0.014 μm
1.4e-5 mm
26 October 2017ZenRyzen 7Raven Ridge482.2 GHz
2,200 MHz
2,200,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
2800H14 nm
0.014 μm
1.4e-5 mm
10 September 2018ZenRyzen 7Raven Ridge483.3 GHz
3,300 MHz
3,300,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
45 W
45,000 mW
0.0603 hp
0.045 kW
3700U12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 7Picasso482.3 GHz
2,300 MHz
2,300,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
3750H12 nm
0.012 μm
1.2e-5 mm
6 January 2019Zen+Ryzen 7Picasso482.3 GHz
2,300 MHz
2,300,000 kHz
35 W
35,000 mW
0.0469 hp
0.035 kW
3780U12 nm
0.012 μm
1.2e-5 mm
October 2019Zen+Ryzen 7Picasso482.3 GHz
2,300 MHz
2,300,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 2700U14 nm
0.014 μm
1.4e-5 mm
8 January 2018ZenRyzen 7Raven Ridge482.2 GHz
2,200 MHz
2,200,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
PRO 3700U12 nm
0.012 μm
1.2e-5 mm
8 April 2019Zen+Ryzen 7Picasso482.3 GHz
2,300 MHz
2,300,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
R1102G14 nm
0.014 μm
1.4e-5 mm
25 February 2020ZenRyzen Embedded221.2 GHz
1,200 MHz
1,200,000 kHz
2.6 GHz
2,600 MHz
2,600,000 kHz
6 W
6,000 mW
0.00805 hp
0.006 kW
R1305G14 nm
0.014 μm
1.4e-5 mm
25 February 2020ZenRyzen Embedded241.5 GHz
1,500 MHz
1,500,000 kHz
2.8 GHz
2,800 MHz
2,800,000 kHz
8 W
8,000 mW
0.0107 hp
0.008 kW
R1505G$ 80.00
€ 72.00
£ 64.80
¥ 8,266.40
14 nm
0.014 μm
1.4e-5 mm
16 April 2019ZenRyzen EmbeddedBanded Kestrel242.4 GHz
2,400 MHz
2,400,000 kHz
3.3 GHz
3,300 MHz
3,300,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
R1606G14 nm
0.014 μm
1.4e-5 mm
16 April 2019ZenRyzen EmbeddedBanded Kestrel242.6 GHz
2,600 MHz
2,600,000 kHz
3.5 GHz
3,500 MHz
3,500,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
V1202B14 nm
0.014 μm
1.4e-5 mm
21 February 2018ZenRyzen EmbeddedGreat Horned Owl242.3 GHz
2,300 MHz
2,300,000 kHz
3.2 GHz
3,200 MHz
3,200,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
V1404I14 nm
0.014 μm
1.4e-5 mm
December 2018ZenRyzen EmbeddedGreat Horned Owl482 GHz
2,000 MHz
2,000,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
V1500B14 nm
0.014 μm
1.4e-5 mm
December 2018ZenRyzen Embedded482.2 GHz
2,200 MHz
2,200,000 kHz
16 W
16,000 mW
0.0215 hp
0.016 kW
V1605B14 nm
0.014 μm
1.4e-5 mm
21 February 2018ZenRyzen EmbeddedGreat Horned Owl482 GHz
2,000 MHz
2,000,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
15 W
15,000 mW
0.0201 hp
0.015 kW
V1756B14 nm
0.014 μm
1.4e-5 mm
21 February 2018ZenRyzen EmbeddedGreat Horned Owl483.25 GHz
3,250 MHz
3,250,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
45 W
45,000 mW
0.0603 hp
0.045 kW
V1780B14 nm
0.014 μm
1.4e-5 mm
December 2018ZenRyzen Embedded483.35 GHz
3,350 MHz
3,350,000 kHz
3.6 GHz
3,600 MHz
3,600,000 kHz
45 W
45,000 mW
0.0603 hp
0.045 kW
V1807B14 nm
0.014 μm
1.4e-5 mm
21 February 2018ZenRyzen EmbeddedGreat Horned Owl483.35 GHz
3,350 MHz
3,350,000 kHz
3.8 GHz
3,800 MHz
3,800,000 kHz
45 W
45,000 mW
0.0603 hp
0.045 kW
Count: 36

Package Diagram

BGA-1140 RR diag.svg

Approximate dimensions of the Raven Ridge package. All dimensions in millimeters.

BGA-1140 BK diag.svg

Approximate dimensions of the Banded Kestrel package. All dimensions in millimeters.

BGA-1140 pn.svg

FP5 package ball numbers.

Pin Map

BGA-1140 pinmap.svg

References

  • "Processor Programming Reference (PPR) for AMD Family 17h Model 18h, Revision B1 Processors (PUB)", AMD Publ. #55570, Rev. 3.14, October 8, 2019
  • "Processor Programming Reference (PPR) for AMD Family 17h Model 20h, Revision A1 Processors", AMD Publ. #55772, Rev. 3.07, May 21, 2020
  • "Product Brief: AMD Ryzen™ Embedded V1000 Processor Family", PID 1887101-F, 2019
  • "Product Brief: AMD Ryzen™ Embedded R1000 Processor Family", PID 19237320-E, 2020
  • "Hot Chips 30: AMD Ryzen™ Processors with Radeon™ Vega Graphics", August 2018

See also

Facts about "Package FP5 - AMD"
designerAMD +
first launchedJanuary 8, 2018 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureZen + and Zen+ +
namePackage FP5 +
packageFP5 +
package contacts1,140 +
package length35 mm (3.5 cm, 1.378 in) +
package pitch0.7 mm (0.0276 in) +
package typeOrganic Micro Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +