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Facts about "Package FP3 - AMD"
designerAMD +
first launchedJune 2014 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureSteamroller +
namePackage FP3 +
packageBGA-854 + and FP3 +
package contacts854 +
package length29 mm (2.9 cm, 1.142 in) +
package pitch0.8 mm (0.0315 in) +
package typeOrganic Micro Ball Grid Array +
package width32 mm (3.2 cm, 1.26 in) +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +