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=== Key changes from {{\\|Zen 2}} ===
 
=== Key changes from {{\\|Zen 2}} ===
* [[7_nm_lithography_process#N7.2B|7 nm+ process]] (from [[7 nm]]) , 20% more density and 10% power reduction compared to Zen 2.  EUV (Extreme Ultraviolet) lithography 7nm+.
 
  
* Unified 8 core CCX with 32MB+ L3$ available to all cores equally
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* Unified 8-core CCX with 32 MiB L3$ available to all 8 cores equally
 +
 
 +
* Wider and more flexible issue in floating-point and integer engines
 +
 
 +
* Increased number of loads and stores, improved prefetching
 +
 
 +
* Increased branch prediction bandwidth, "zero-bubble" branch prediction
 +
 
 +
* Improved µop cache
 +
 
 +
* [Unconfirmed] [[7_nm_lithography_process#N7.2B|7 nm+ process]] (from [[7 nm]]), 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+.
  
 
{{expand list}}
 
{{expand list}}

Revision as of 07:21, 10 October 2020

Edit Values
Zen 3 µarch
General Info
Arch TypeCPU
DesignerAMD
ManufacturerTSMC
Introduction2020
Process7 nm+
Succession

Zen 3 is a planned microarchitecture being developed by AMD as a successor to Zen 2.

History

amd zen future roadmap.jpg

Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the Zen microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize 7nm+ process.

Codenames

amd zen2-3 roadmap.png
Symbol version future.svg Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.
Core C/T Target
Milan 64/128 High-end server multiprocessors
Genesis Peak  ?/? Workstation & enthusiasts market processors
Vermeer 16/32 Mainstream to high-end desktops & enthusiasts market processors
Cezanne  ?/? Mainstream desktop & mobile processors with GPU

Process technology

Zen 3 will be fabricated on TSMC's 7nm+ process.

Architecture

Nothing is currently known about the architectural improvements that are being done for Zen 3.

Key changes from Zen 2

  • Unified 8-core CCX with 32 MiB L3$ available to all 8 cores equally
  • Wider and more flexible issue in floating-point and integer engines
  • Increased number of loads and stores, improved prefetching
  • Increased branch prediction bandwidth, "zero-bubble" branch prediction
  • Improved µop cache
  • [Unconfirmed] 7 nm+ process (from 7 nm), 20% more density and 10% power reduction compared to Zen 2. EUV (Extreme Ultraviolet) lithography 7nm+.

This list is incomplete; you can help by expanding it.

References

  • AMD 'Tech Day', February 22, 2017
  • AMD 2017 Financial Analyst Day, May 16, 2017

All Zen3 Chips

Ryzen brand logo
List of all Zen3 based Processors
Model Price Family Core Cores Threads TDP L3 Base Turbo
AMD Ryzen 7 5600X $ 299 Ryzen 5 Vermeer 6 12 65 W 32 MiB 3.7 GHz 4.6 GHz
AMD Ryzen 7 5800X $ 449 Ryzen 7 Vermeer 8 16 105 W 32 MiB 3.8 GHz 4.7 GHz
AMD Ryzen 9 5900X $ 549 Ryzen 9 Vermeer 12 24 105 W 64 (2*32) MiB 3.7 GHz 4.8 GHz
AMD Ryzen 9 5950X $ 799 Ryzen 9 Vermeer 16 32 105 W 64 (2*32) MiB 3.4 GHz 4.9 GHz

See Also