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  • {{ic family ...ges/socket-g1|PGA-988]] ([[packages/socket-g1|Socket G1]]) packaging. They all have the following features:
    43 KB (5,740 words) - 02:11, 3 October 2022
  • ...ters may be formed by powering selected LED elements. SSDs come in various packages and pin arranges. ...d together. In a CA SSD, power must be supplied to anode that is common to all the segments. Appropriate segments can be lit up by applying ground to them
    4 KB (490 words) - 08:47, 24 July 2019
  • ...re-defined packages. Sometimes the device that's designed does not utilize all the pins for various reasons. It may also be as a result of [[post-package * [[IC package]]
    2 KB (238 words) - 19:56, 26 November 2015
  • {{ic family ...came from its simplicity, being an [[in-order]] dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].
    17 KB (2,292 words) - 08:32, 16 July 2019
  • {{ic family ...t Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:
    20 KB (2,661 words) - 23:45, 10 October 2017
  • {{ic family ...t Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:
    25 KB (3,201 words) - 02:13, 22 September 2018
  • {{ic family | type = System in packages
    13 KB (1,784 words) - 07:04, 6 April 2019
  • {{ic family All Core i3 processors up to Coffee Lake are dual-core.
    25 KB (3,397 words) - 02:12, 3 October 2022
  • {{ic family ...{x86|AES}} instructions. These processors use {{packages|Socket-G1}}. They all have the following features:
    34 KB (4,663 words) - 00:50, 10 October 2022
  • {{ic family ...al-die configuration and use a multi-chip module {{amd|Package SP4}}. Both packages are ball grid arrays (BGAs) and are pin-compatible with each other. Geared
    5 KB (724 words) - 14:06, 25 May 2019
  • ...('''CoWoS''') is a [[two-point-five dimensional integrated circuit]] (2.5D IC) [[through-silicon via]] (TSV) [[interposer]]-based packaging technology de ..., TSMC has since increased the interposer size to 1,700 mm². Those large packages are referred to as CoWoS-XL2.
    6 KB (943 words) - 22:31, 1 August 2021