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Difference between revisions of "6 µm lithography process"

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{{Lithography processes}}
 
{{Lithography processes}}
The '''6μm lithography process''' was the semiconductor process technology used by some semiconductor companies during the years of early to mid 1970s. This process was later superseded by [[5 µm]], [[3 µm]], and [[2 µm]] processes.
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The '''6μm lithography process''' was the semiconductor process technology used by some semiconductor companies during the early to mid 1970s. This process was later superseded by [[5 µm]], [[3 µm]], and [[2 µm]] processes.
  
 
== Industry ==
 
== Industry ==

Revision as of 07:45, 26 April 2016

The 6μm lithography process was the semiconductor process technology used by some semiconductor companies during the early to mid 1970s. This process was later superseded by 5 µm, 3 µm, and 2 µm processes.

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch​
Metal Layers​
Technology​
Wafer
Intel Motorola
 
1971 1971
 ? nm  ? nm
 ? nm  ? nm
2 2
nMOS depletion-mode nMOS
76 mm

Microprocessors

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