Revision as of 20:20, 25 February 2017

Semiconductor lithography processes technology

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The 45 nanometer (45 nm) lithography process is a full node semiconductor manufacturing process following the 55 nm process stopgap. Commercial integrated circuit manufacturing using 45 nm process began in 2007. This technology was superseded by the 40 nm process (HN) / 32 nm process (FN) in 2010.

Industry

In January of 2006 Intel announced that they've been able to fabricate the first fully functional SRAM chips on a 45 nm process. As a preview Intel showcased 45nm SRAM chip (shown below) packing more than 1 billion transistors. Intel opened 3 45 nm facilities, their initial D1D facility in Oregon, Fab 32 in Arizona and Fab 28 in Israel.

Intel

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  6T SRAM Bit-Cell

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  Die photo of an Intel 45 nm shuttle test chip including 153 MiB SRAM and logic test circuits

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  300 mm wafer with 45 nm shuttle test chips

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  Intel engineer holding 300 mm wafer with 45 nm shuttle test chips

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  Intel 300 mm wafer with 45 nm shuttle test chips

45 nm Microprocessors

• AMD
  • Athlon II
  • Opteron
  • Phenom II
• IBM
  • Power7
• Intel
  • Atom
  • Celeron
  • Core 2 Duo
  • Core 2 Extreme
  • Core 2 Quad
  • Core 2 Quad Extreme
  • Core 2 Solo
  • Core i3
  • Core i5
  • Core i7
  • Core i7EE
  • Pentium Dual-Core
  • Pentium
  • Xeon

This list is incomplete; you can help by expanding it.n Chips== This list is incomplete; you can help by expanding it.

45 nm Microarchitectures

• Intel
  • Bonnell
  • Nehalem
  • Penryn
• AMD
  • K10

This list is incomplete; you can help by expanding it.