Revision as of 23:38, 3 June 2016

Semiconductor lithography processes technology

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The 350 nanometer (350 nm) lithography process is a full node semiconductor manufacturing process following the 500 nm process node. Commercial integrated circuit manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by 250 nm in 1999.

Industry

Design Rules

350 nm Microprocessors

• Intel
  • Pentium
  • Pentium MMX
  • Pentium OverDrive MMX
  • Pentium II
  • Mobile Pentium II
• AMD
  • Am5x86
  • Enhanced Am486
  • K6
• DEC
  • Alpha 21164A
  • Alpha 21264
• HAL
  • SPARC64 II
• Fujitsu
  • TurboSPARC
• IBM
  • PowerPC 603ev
  • PowerPC 604
  • PowerPC 604e
  • PowerPC RS64-II
• Cyrix
  • 6x86
• MIPS
  • R5000
  • R10000
  • R4400
• Sun
  • UltraSPARC II
  • UltraSPARC IIi
• NEC
  • VR4300
• Parallax
  • Propeller 1

This list is incomplete; you can help by expanding it.

350 nm Microcontrollers

• AMD
  • Am186Cx
  • Am186Ex

This list is incomplete; you can help by expanding it.

350 nm Microarchitectures

This list is incomplete; you can help by expanding it.