From WikiChip
Difference between revisions of "350 nm lithography process"

(Industry)
Line 15: Line 15:
 
! Value
 
! Value
 
|-
 
|-
| ? nm
+
| 550 nm
 
|-
 
|-
 
| 880 nm
 
| 880 nm

Revision as of 16:35, 24 April 2016

The 350 nm lithography process is a full node semiconductor manufacturing process following the 500 nm process node. Commercial integrated circuit manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by 250 nm in 1999.

Industry

Fab
Type​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel
Value
550 nm
880 nm
18.1 µm2

Design Rules

350 nm Microprocessors

This list is incomplete; you can help by expanding it.

350 nm Microarchitectures

This list is incomplete; you can help by expanding it.