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Difference between revisions of "3.5 µm lithography process"

(Created page with "{{Lithography processes}} The '''3.5 μm lithography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This proces...")
 
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{{Lithography processes}}
 
{{Lithography processes}}
 
The '''3.5 μm lithography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This process was later superseded by [[3 µm]], [[2 µm]], and [[1.5 µm]] processes.
 
The '''3.5 μm lithography process''' was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This process was later superseded by [[3 µm]], [[2 µm]], and [[1.5 µm]] processes.
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== Industry ==
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{{scrolling table/top|style=text-align: right; | first=Fab
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|Process Name
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|1st Production
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|Contacted Gate Pitch
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|Interconnect Pitch
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|Metal Layers
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|Technology
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|Wafer
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}}
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{{scrolling table/mid}}
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|-
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! [[Motorola]]
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|- style="text-align: center;"
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|  
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|- style="text-align: center;"
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|  
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|-
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| ? nm
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|-
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| ? nm
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|-
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| ?
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|-
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| nMOS
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|-
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| ?"
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{{scrolling table/end}}
  
 
== 3.5 μm microcontrollers ==
 
== 3.5 μm microcontrollers ==
* {{bell|BELLMAC-4|Bell Labs BELLMAC-4}}
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* Bell Labs
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** {{bell|BELLMAC-4}}
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* Motorola
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** {{motorola|68000}}
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** {{motorola|68010}}
 
{{expand list}}
 
{{expand list}}
  

Revision as of 22:43, 26 April 2016

The 3.5 μm lithography process was the semiconductor process technology used by some semiconductor companies during the mid 1970s. This process was later superseded by 3 µm, 2 µm, and 1.5 µm processes.

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch​
Metal Layers​
Technology​
Wafer
Motorola
 
 
 ? nm
 ? nm
 ?
nMOS
 ?"

3.5 μm microcontrollers

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