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Difference between revisions of "2 µm lithography process"

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  |Interconnect Pitch (M1P)
 
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! [[Toshiba]] || [[STMicro]]
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! [[Toshiba]] || [[STMicro]] || [[Motorola]] || [[TI]] || [[AMD]]
 
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|  || BCD-Offline
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|  || BCD-Offline || || ||
 
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| 1986 || 1992
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| 1986 || 1992 || || ||
 
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! Value !! Value
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| ? nm  || ? nm || ? nm || ? nm || ? nm
 
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| ? nm  || ? nm  
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| ? nm  || ? nm || ? nm || ? nm || ? nm
 
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|-
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| ? nm || ? nm
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| ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> ||  ? µm<sup>2</sup>  
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| ? µm<sup>2</sup> ||  ? µm<sup>2</sup>  
 
 
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Revision as of 21:23, 26 April 2016

basic wafer drawing.svg Semiconductor lithography processes technology
v · d · e

The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Toshiba STMicro Motorola TI AMD
BCD-Offline
1986 1992
 ? nm  ? nm  ? nm  ? nm  ? nm
 ? nm  ? nm  ? nm  ? nm  ? nm
 ? µm2  ? µm2  ? µm2  ? µm2  ? µm2

Microprocessors

This list is incomplete; you can help by expanding it.

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