Semiconductor & Computer Engineering
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Difference between revisions of "2 µm lithography process"
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{{lithography processes}} | {{lithography processes}} | ||
| − | The '''2 µm lithography process''' was the semiconductor process technology used by the some semiconductor companies in the | + | The '''2 µm lithography process''' was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by [[1.5 µm]], [[1.3 µm]], and [[1.2 µm]] processes. |
== Industry == | == Industry == | ||
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! [[Toshiba]] || [[STMicro]] | ! [[Toshiba]] || [[STMicro]] | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
| − | | || | + | | || BCD-Offline |
|- style="text-align: center;" | |- style="text-align: center;" | ||
| 1986 || 1992 | | 1986 || 1992 | ||
Revision as of 08:12, 25 April 2016
Semiconductor lithography processes technology
The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
Microprocessors
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