Semiconductor & Computer Engineering
From WikiChip
Difference between revisions of "2019"
(Created page with "{{year|year=2019}} In '''2019''':") |
|||
| (13 intermediate revisions by 3 users not shown) | |||
| Line 1: | Line 1: | ||
{{year|year=2019}} | {{year|year=2019}} | ||
In '''2019''': | In '''2019''': | ||
| + | |||
| + | * January 3: [[Arm]] announces the [[Mali-C52]] and [[Mali-C32]] ISPs. | ||
| + | * January 6: AMD introduces 2nd generation {{amd|Zen+|l=arch}} mobile processor, codename {{amd|Picasso|l=core}} | ||
| + | * January 7: Intel unveils {{intel|Lakefield}} SoC, {{intel|Snow Ridge|l=arch}}, and {{intel|Ice Lake (Client)|l=arch}} | ||
| + | * January 7: Huawei unveils HiSilicon's [[Kunpeng 920]] high-performance [[ARM]] server chip | ||
| + | * February 20: [[Arm]] introduces the [[Neoverse E1]] and [[Neoverse N1]] server platforms | ||
| + | * April 2: [[Intel]] introduces {{intel|Cascade Lake|l=arch}} servers | ||
| + | * April 16: Intel exits the modem market and the development of their 5G modem | ||
| + | * April 16: AMD introduces ultra-low power embedded Ryzen, codename {{amd|Banded Kestrel|l=core}} | ||
| + | * May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]]. | ||
| + | * September 10: [[Apple]] announces the {{apple|ax|A13}} Bionic. | ||
| + | * September 12: [[IBM]] introduces the {{ibm|z15|l=arch}} | ||
| + | * October 8: Arm announces {{armh|Matterhorn|l=arch}} with {{arm|MatMUL}} extension. | ||
| + | * October 14: {{sc|ARCHER 2}} is announced | ||
| + | * October 24: Intel unveils the {{intel|Tremont|l=arch}} | ||
| + | * November 12: Intel launches the [[Nervana]] {{nervana|NNP}} family of [[neural processors]] | ||
Latest revision as of 11:05, 1 February 2020
| 2019 | |
|---|---|
| Unix Time | 1546300800 - 1577836799 |
| Years | |
In 2019:
- January 3: Arm announces the Mali-C52 and Mali-C32 ISPs.
- January 6: AMD introduces 2nd generation Zen+ mobile processor, codename Picasso
- January 7: Intel unveils Lakefield SoC, Snow Ridge, and Ice Lake (Client)
- January 7: Huawei unveils HiSilicon's Kunpeng 920 high-performance ARM server chip
- February 20: Arm introduces the Neoverse E1 and Neoverse N1 server platforms
- April 2: Intel introduces Cascade Lake servers
- April 16: Intel exits the modem market and the development of their 5G modem
- April 16: AMD introduces ultra-low power embedded Ryzen, codename Banded Kestrel
- May 7: DoE announces Frontier contract has been awarded to Cray and AMD.
- September 10: Apple announces the A13 Bionic.
- September 12: IBM introduces the z15
- October 8: Arm announces Matterhorn with MatMUL extension.
- October 14: ARCHER 2 is announced
- October 24: Intel unveils the Tremont
- November 12: Intel launches the Nervana NNP family of neural processors
