Semiconductor & Computer Engineering
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Difference between revisions of "2019"
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* April 16: AMD introduces ultra-low power embedded Ryzen, codename {{amd|Banded Kestrel|l=core}} | * April 16: AMD introduces ultra-low power embedded Ryzen, codename {{amd|Banded Kestrel|l=core}} | ||
* May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]]. | * May 7: DoE announces {{sc|Frontier}} contract has been awarded to [[Cray]] and [[AMD]]. | ||
| + | * September 12: [[IBM]] introduces the {{ibm|z15|l=arch}} | ||
Revision as of 19:01, 14 September 2019
| 2019 | |
|---|---|
| Unix Time | 1546300800 - 1577836799 |
| Years | |
In 2019:
- January 3: Arm announces the Mali-C52 and Mali-C32 ISPs.
- January 6: AMD introduces 2nd generation Zen+ mobile processor, codename Picasso
- January 7: Intel unveils Lakefield SoC, Snow Ridge, and Ice Lake (Client)
- January 7: Huawei unveils HiSilicon's Kunpeng 920 high-performance ARM server chip
- February 20: Arm introduces the Neoverse E1 and Neoverse N1 server platforms
- April 2: Intel introduces Cascade Lake servers
- April 16: Intel exists the modem market and the development of their 5G modem
- April 16: AMD introduces ultra-low power embedded Ryzen, codename Banded Kestrel
- May 7: DoE announces Frontier contract has been awarded to Cray and AMD.
- September 12: IBM introduces the z15
