Semiconductor & Computer Engineering
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Difference between revisions of "2018"
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* June 29: Fujitsu sells [[Mie Fujitsu Semiconductor]] (MIFS) to [[UMC]] | * June 29: Fujitsu sells [[Mie Fujitsu Semiconductor]] (MIFS) to [[UMC]] | ||
* July 3: [[Baidu]] unvailed {{baidu|Kunlun}}, a new family of custom [[neural processors]] | * July 3: [[Baidu]] unvailed {{baidu|Kunlun}}, a new family of custom [[neural processors]] | ||
| + | * July 12: Intel launches {{intel|Coffee Lake E|l=core}}-based {{intel|Xeon E}} entry-level workstation processors | ||
Revision as of 18:25, 13 July 2018
| 2018 | |
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| Unix Time | 1514764800 - 1546300799 |
| Years | |
In 2018:
- January 3: A new series of side-channel attacks were disclosed which had industry-wide implications (Meltdown and Spectre).
- January 3: Samsung announces their next flagship microprocessor, the Exynos 9810
- January 7-12: CES 2018
- January 7: Intel launches 8th Gen Intel Core with Radeon RX Vega M, formerly Kaby Lake G.
- January 8: NVIDIA launches the Drive Xavier autonomous car SoC.
- January 10: SPEC CPU2006 has been retired.
- January 24: Imagination Technologies launches the PowerVR Series8XT GT8540, a new high-performance GPU based on Furian.
- February 5: Ampere Computing announces their first ARM processor, the A1.
- February 7: Intel launches Xeon D processors based on the Skylake microarchitecture (formerly Skylake DE)
- February 11-15: ISSCC 2018
- February 12: AMD launched Ryzen desktop APUs based on Zen and Vega
- February 13: ARM announces two new neural processors IPs - the ML processor for inference processing and the OD processor for real-time object detection.
- February 21: AMD launches EPYC Embedded processors (formerly Snowy Owl) and Ryzen Embedded (formerly Great Horned Owl)
- February 26: Intel started shipping its Stratix 10 TX FPGAs with up to 58 Gbps PAM4 transmission capabilities.
- February 26: GreenWaves launches their first product, the GAP8, an ultra-low power RISC-V microprocessor for intelligence IoT
- February 27: Qualcomm launches the Snapdragon 700 family intended to bridge the gap between the 600 and 800 series by offering a mix of premium features and mid-range pricing.
- March 4: Microchip announced it will acquire Microsemi for $8.35 billion.
- March 6: Google announces Bristlecone, a 72 qubits chip
- March 24: John Hennessy and David Patterson receive 2017 ACM A.M. Turing Award for pioneering a systematic, quantitative approach to the design and evaluation of computer architectures with enduring impact on the microprocessor industry.
- March 27: GPU Technology Conference
- April 1: ON Semiconductor increased stake in Aizu Fujitsu Semiconductor to 40%
- April 19: AMD launches Ryzen 2nd generation based on the Zen+ microarchitecture.
- May 1: MIPS Technologies launches the nanoMIPS ISA
- May 1: MIPS launches the I7200 based on the nanoMIPS ISA
- May 2: ARM launches a new Cortex-M35P secure core
- May 3: Cambricon launches new neural processors for data center
- May 8: Google announces the TPU 3.0
- May 15: Intel launches Cannon Lake
- May 23: Qualcomm launches the Snapdragon 700 series of premium mid-range SoCs
- June 3: Cavium announces general availability for the ThunderX2 based on Vulcan
- June 5: Intel discloses Whiskey Lake and Amber Lake
- June 13: Wave Computing acquires MIPS Technologies
- June 16: ORNL's Summit Supercomputer became the world's fastest
- June 24: Fujitsu announces their Post-K CPU prototype was complete
- June 29: Fujitsu sells Mie Fujitsu Semiconductor (MIFS) to UMC
- July 3: Baidu unvailed Kunlun, a new family of custom neural processors
- July 12: Intel launches Coffee Lake E-based Xeon E entry-level workstation processors
