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16 nm lithography process
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The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Commercial integrated circuit manufacturing using 16 nm process began in 2014. The term "16 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. This technology is set to be replaced with 10 nm process in 2017.

Industry

Fab
Wafer​
 ​
Fin Pitch​
Fin Width​
Fin Height​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
TSMC
300mm
Value[1] 20 nm Δ
48 nm N/A
 ? nm
37 nm
90 nm 1.03x
70 nm 1.09x
0.07 µm2 0.55x

16 nm Microprocessors

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16 nm Microarchitectures

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References

  1. TechInsights/Chipworks, Kevin Gibb, The ConFab 2016