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Difference between revisions of "16 nm lithography process"

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== Industry ==
 
== Industry ==
 
{{scrolling table/top|style=text-align: right; | first=Fab
 
{{scrolling table/top|style=text-align: right; | first=Fab
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|1st Production​
 +
|Transistor
 
  |Wafer
 
  |Wafer
 
  | 
 
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! colspan="2" | [[TSMC]]
 
! colspan="2" | [[TSMC]]
 
|- style="text-align: center;"
 
|- style="text-align: center;"
| colspan="2" | 300mm
+
| colspan="2" | 2015
 +
|- style="text-align: center;"
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| colspan="2" | FinFET
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|- style="text-align: center;"
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| colspan="2" | 300 mm
 
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|-
 
! Value !! [[20 nm]] Δ  
 
! Value !! [[20 nm]] Δ  

Revision as of 21:17, 15 March 2017

The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Commercial integrated circuit manufacturing using 16 nm process began in 2014. The term "16 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. This technology is set to be replaced with 10 nm process in 2017.

Industry

Fab
1st Production​​
Transistor​
Wafer​
 ​
Fin Pitch​
Fin Width​
Fin Height​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
TSMC
2015
FinFET
300 mm
Value 20 nm Δ
48 nm N/A
 ? nm
37 nm
90 nm 1.03x
64 nm 0.96x
0.07 µm² 0.86x

TSMC

TSMC demonstrated their 128 Mebibit SRAM wafer from their 16 nm HKMG FinFET process at the 2014 IEEE ISSCC.

16 nm Microprocessors

This list is incomplete; you can help by expanding it.

16 nm Microarchitectures

This list is incomplete; you can help by expanding it.

References

  • Chen, Yen-Huei, et al. "A 16 nm 128 Mb SRAM in High-κ Metal-Gate FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications." IEEE Journal of Solid-State Circuits 50.1 (2015): 170-177.
  • Wu, Shien-Yang, et al. "A 16nm FinFET CMOS technology for mobile SoC and computing applications." Electron Devices Meeting (IEDM), 2013 IEEE International. IEEE, 2013.
  • TechInsights/Chipworks, Kevin Gibb, The ConFab 2016