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Difference between revisions of "16 nm lithography process"

(16 nm Microprocessors)
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| colspan="2" | 300mm
 
| colspan="2" | 300mm
 
|-
 
|-
! Value !! [[20 nm]] Δ  
+
! Value<ref>TechInsights/Chipworks, Kevin Gibb, The ConFab 2016</ref> !! [[20 nm]] Δ  
 
|-
 
|-
 
| 48 nm || rowspan="3" | N/A
 
| 48 nm || rowspan="3" | N/A
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| ? nm
 
| ? nm
 
|-
 
|-
| ? nm
+
| 37 nm
 
|-
 
|-
 
| 90 nm || 1.03x
 
| 90 nm || 1.03x
 
|-
 
|-
| 64 nm || 1.00x
+
| 70 nm || 1.09x
 
|-
 
|-
 
| 0.07 µm<sup>2</sup> || 0.55x
 
| 0.07 µm<sup>2</sup> || 0.55x
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== 16 nm Microarchitectures==
 
== 16 nm Microarchitectures==
 
{{expand list}}
 
{{expand list}}
 +
 +
== References ==
 +
{{reflist}}
  
  
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 21:48, 2 February 2017

The 16 nanometer (16 nm) lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Commercial integrated circuit manufacturing using 16 nm process began in 2014. The term "16 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch. This technology is set to be replaced with 10 nm process in 2017.

Industry

Fab
Wafer​
 ​
Fin Pitch​
Fin Width​
Fin Height​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
TSMC
300mm
Value[1] 20 nm Δ
48 nm N/A
 ? nm
37 nm
90 nm 1.03x
70 nm 1.09x
0.07 µm2 0.55x

16 nm Microprocessors

This list is incomplete; you can help by expanding it.

16 nm Microarchitectures

This list is incomplete; you can help by expanding it.

References

  1. TechInsights/Chipworks, Kevin Gibb, The ConFab 2016