Editing 150 nm lithography process

{{lithography processes}}
The '''150 nanometer (150 nm) lithography process''' is a [[technology node#half node|half-node]] semiconductor manufacturing process used as a stopgap between the [[180 nm lithography process|180 nm]] and [[130 nm lithography process|130 nm]] processes. Commercial [[integrated circuit]] manufacturing using 150 nm process began in early 2000s. This technology superseded by commercial [[130 nm]], [[110 nm]], and [[90 nm]] processes.

== Industry ==
{{scrolling table/top|style=text-align: right; | first=Fab
 |Process Name
 |1st Production
 |Metal Layers
 |&nbsp;
 |Contacted Gate Pitch
 |Interconnect Pitch (M1P)
 |SRAM bit cell
}}
{{scrolling table/mid}}
|-
! colspan="2" | [[TSMC]] !! colspan="2" | [[Fujitsu]]
|- style="text-align: center;"
| colspan="2" |   || colspan="2" | CS-85
|- style="text-align: center;"
| colspan="2" | 2000 || colspan="2" | 2002
|- style="text-align: center;"
| colspan="2" |  || colspan="2" | 6
|-
! Value !! [[180 nm]] Δ !! Value !! [[180 nm]] Δ
|-
| ? nm || ?x || ? nm || ?x
|-
| ? nm || ?x || ? nm || ?x
|-
| 3.42 µm<sup>2</sup> || 0.74x || ? µm<sup>2</sup> || ?x
{{scrolling table/end}}

== 150 nm Microprocessors==
* Cyrix
** {{cyrix|Cyrix III}}
* HAL (Fujitsu)
** {{hal|SPARC64 GP}}
{{expand list}}


== 150 nm microarchitectures ==
* VIA Technologies
** {{via|Samuel 2|l=arch}}

[[category:lithography]]