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1.5 µm lithography process
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The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of roughly 1.5 µm between the source and drain. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.

Industry[edit]

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
Metal Layers​​
SRAM bit cell​
Wafer
Intel Intel Intel HP AMD
HMOS-II HMOS-E P646 (CHMOS III) NMOS III
1982 1982 1985 1981 1982
 ? nm  ? nm  ? nm 1.5 µm
 ? nm  ? nm  ? nm 2.5 µm
2  ? 2 2 2
 ? µm2  ? µm2  ? µm2  ? µm2  ? µm2
125 mm 150 mm

Design Rules[edit]

1.5 µm Microprocessors[edit]

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1.5 µm Microarchitectures[edit]

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