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{{lithography processes}}
 
{{lithography processes}}
The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes.
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The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of roughly 1.5 µm between the source and drain. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes.
  
 
== Industry ==
 
== Industry ==
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{{scrolling table/mid}}
 
{{scrolling table/mid}}
 
|-
 
|-
! [[Intel]]  || [[Intel]] (CHMOS III) || [[HP]] || [[AMD]]
+
! [[Intel]] || [[Intel]]  || [[Intel]] || [[HP]] || [[AMD]] || [[DEC]]
 
|- style="text-align: center;"
 
|- style="text-align: center;"
| || P646 || NMOS III ||  
+
| HMOS-II || HMOS-E || P646 (CHMOS III) || NMOS III || || CMOS-2
 
|- style="text-align: center;"
 
|- style="text-align: center;"
| 1982 || 1985 || 1981 || 1982
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| 1982 || 1982 || 1985 || 1981 || 1982 ||
 
|-
 
|-
| ? nm  || ? nm  || 1.5 µm ||
+
| ? nm || ? nm  || ? nm  || 1.5 µm || ||
 
|-
 
|-
| ? nm || ? nm || 2.5 µm ||
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| ? nm ||  ? nm || ? nm || 2.5 µm || ||
 
|-
 
|-
| 2 || 2 || 2 || 2
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| 2 || ? || 2 || 2 || 2 || 2
 
|-
 
|-
| ? µm<sup>2</sup> ||  ? µm<sup>2</sup> ||  ? µm<sup>2</sup> || ? µm<sup>2</sup>
+
| ? µm² ||  ? µm² ||  ? µm² || ? µm² || ? µm² ||
 
|-
 
|-
| 125 mm  || 150 mm  ||  ||
+
| 125 mm  || || 150 mm  ||  || ||
 
{{scrolling table/end}}
 
{{scrolling table/end}}
  
=== Design Rules ===
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=== HP ===
 
{| class="wikitable collapsible collapsed"
 
{| class="wikitable collapsible collapsed"
 
|-
 
|-
! colspan="2" | HP NMOS-III Design Rules
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! colspan="3" | [[HP]] NMOS-III Design Rules
 
|-
 
|-
 
! Layer !! Description
 
! Layer !! Description
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|-
 
|-
 
| M2 || 5.0 µm wide line / 3.0 µm space<br>0.4 ohm/square sheet resistance  
 
| M2 || 5.0 µm wide line / 3.0 µm space<br>0.4 ohm/square sheet resistance  
 +
|}
 +
 +
=== DEC ===
 +
[[DEC]] operated their 1.5 µm process ('''CMOS-2''') at their Hudson foundry. This 2 ML process had an effective channel length of 0.9 µm with a polycide width of 1.5 µm (1.5 µm spacing) and a T<sub>OX</sub> of 22.5 nm.
 +
 +
{| class="wikitable collapsible collapsed"
 +
|-
 +
! colspan="2" | [[DEC]] Design Rules
 +
|-
 +
! !! Width !! Spacing
 +
|-
 +
| Polycide || 1.5 µm || 1.5 µm
 +
|-
 +
| Metal 1 || 3 µm || 1.5 µm
 +
|-
 +
| Metal 1 Contact || 1.5 µm x 1.5 µm
 +
|-
 +
| Metal 2 || 3.75 µm || 1.5
 +
|-
 +
| Metal 2 Contact || 1.5 µm x 1.5 µm
 
|}
 
|}
  
 
== 1.5 µm Microprocessors ==
 
== 1.5 µm Microprocessors ==
 
* AMD
 
* AMD
 +
** {{amd|Am186}}
 
** {{amd|Am286}}
 
** {{amd|Am286}}
 
* Intel
 
* Intel
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** {{decc|Rigel}}
 
** {{decc|Rigel}}
 
{{expand list}}
 
{{expand list}}
 +
 +
== 1.5 µm Microarchitectures ==
 +
* ARM
 +
** {{armh|ARM3|l=arch}}
 +
* Intel
 +
** {{intel|80386|l=arch}}
 +
{{expand list}}
 +
* DEC
 +
** {{decc|MicroPrism|l=arch}}
 +
** {{decc|MicroTitan|l=arch}}
 +
  
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 17:40, 28 June 2017

The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. This process had an effective channel length of roughly 1.5 µm between the source and drain. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
Metal Layers​​
SRAM bit cell​
Wafer
Intel Intel Intel HP AMD DEC
HMOS-II HMOS-E P646 (CHMOS III) NMOS III CMOS-2
1982 1982 1985 1981 1982
 ? nm  ? nm  ? nm 1.5 µm
 ? nm  ? nm  ? nm 2.5 µm
2  ? 2 2 2 2
 ? µm²  ? µm²  ? µm²  ? µm²  ? µm²
125 mm 150 mm

HP

DEC

DEC operated their 1.5 µm process (CMOS-2) at their Hudson foundry. This 2 ML process had an effective channel length of 0.9 µm with a polycide width of 1.5 µm (1.5 µm spacing) and a TOX of 22.5 nm.

1.5 µm Microprocessors

This list is incomplete; you can help by expanding it.

1.5 µm Microarchitectures

This list is incomplete; you can help by expanding it.