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Difference between revisions of "1.5 µm lithography process"

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== Industry ==
 
== Industry ==
Intel's 1.5 µm (''P646'') was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.
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Intel's 1.5 µm (CHMOS III; ''P646'') was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.
 
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Revision as of 23:23, 24 April 2016

The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.

Industry

Intel's 1.5 µm (CHMOS III; P646) was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.

Fab
Process Name​
1st Production​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel Intel
P646
1982 1985
Value Value
 ? nm  ? nm
 ? nm  ? nm
 ? µm2  ? µm2

1.5 µm Microprocessors