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1.3 µm lithography process
Revision as of 14:23, 10 January 2019 by 162.218.229.106 (talk) (Made consistent dimension references in the text.)

The 1.3 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1.3 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.

Industry

Fab
Process Name​
1st Production​
Voltage​
 ​
Gate Length​
Interconnect Pitch (M1P)​
SRAM bit cell
Motorola Hitachi Fujitsu
Hi-CMOS III  
1987 1987
5 V
Value Value 2 µm Δ Value
 ? nm 1.2 µm 0.60x  ? nm
 ? nm 1.3 µm 0.43x nm
 ? µm²  ? µm²  ? µm²

1.3 µm Microprocessors

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References

  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.