Semiconductor & Computer Engineering
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Difference between revisions of "1.3 µm lithography process"
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Revision as of 23:04, 20 May 2018
Semiconductor lithography processes technology
The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Voltage |
| |
| Gate Length |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Motorola | Hitachi | Fujitsu | |
|---|---|---|---|
| Hi-CMOS III | |||
| 1987 | 1987 | ||
| 5 V | |||
| Value | Value | 2 µm Δ | Value |
| ? nm | 1.2 µm | 0.60x | ? nm |
| ? nm | 1.3 µm | 0.43x | nm |
| ? µm² | ? µm² | ? µm² | |
1.3 µm Microprocessors
This list is incomplete; you can help by expanding it.
References
- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
