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Difference between revisions of "1.2 µm lithography process"

(1.2 µm Microprocessors)
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** {{qualcomm|MSM}} (prototype)
 
** {{qualcomm|MSM}} (prototype)
 
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== References ==
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* Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
  
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 05:38, 4 April 2017

The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.

Industry

Fab
Process Name​
1st Production​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel NEC
 
1987 1988
Value Value
 ? nm  ? nm
 ? nm  ? nm
 ? µm2  ? µm2

1.2 µm Microprocessors

This list is incomplete; you can help by expanding it.

References

  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.