Page title matches

Page text matches

• loongson/godson 2/2g
  | socket 0 = BGA-741 | socket 0 type = BGA
  4 KB (455 words) - 16:31, 13 December 2017
• loongson/godson 2/2h
  | socket 0 = BGA-741 | socket 0 type = BGA
  5 KB (591 words) - 16:31, 13 December 2017
• intel/cores/silverthorne
  | socket = BGA-437 | socket 2 = BGA-441
  4 KB (503 words) - 05:54, 15 April 2017
• intel/cores/tolapai
  | socket = BGA-1088
  1 KB (118 words) - 05:10, 3 April 2017
• intel/ep80579
  | socket = BGA-1088
  1 KB (122 words) - 01:04, 3 April 2017
• intel/cores/coffee lake u
  .../s transfer rate. All Coffee Lake U processors use {{intel|BGA-1356|Socket BGA-1528}} and incorporate 128 MiB of side cache.
  4 KB (553 words) - 23:05, 12 May 2020
• intel/cores/skylake y
  |socket=BGA-1515 ...lowing for a 4 GT/s transfer rate. SKL-Y chips use {{intel|BGA-1515|Socket BGA-1515}}.
  4 KB (571 words) - 06:30, 6 April 2019
• intel/cores/skylake h
  | socket = BGA-1440 ...icroprocessor]] and the [[chipset]]. Skylake H are {{intel|BGA-1440|Socket BGA-1440}} and use {{intel|Sunrise Point}} chipset ({{intel|Platform Controller
  5 KB (630 words) - 02:08, 16 January 2019
• intel/cores/skylake u
  |socket=BGA-1356 ...4 GT/s transfer rate. All Skylake U processors use {{intel|BGA-1356|Socket BGA-1356}} and all Iris models include 64 MiB of side cache.
  5 KB (743 words) - 08:07, 21 August 2017
• intel/cores/coffee lake h
  ...microprocessor]] and the [[chipset]]. Coffee Lake H are {{intel|FCBGA-1440|BGA-1440}} and use 300-series chipset ({{intel|Platform Controller Hub|HUB}}).
  5 KB (648 words) - 17:43, 6 December 2018
• intel/cores/kaby lake r
  ...GT/s transfer rate. All Kaby Lake R processors use {{intel|BGA-1356|Socket BGA-1356}}.
  5 KB (751 words) - 09:52, 11 February 2019
• microsoft/scorpio engine
  |package name=amd/packages/bga-2409 [[Category:all ic packages]]{{#set:package=BGA-2409|package type=FC-OBGA}}
  15 KB (2,390 words) - 02:54, 17 May 2023
• sun microsystems/ultrasparc/stp1030bga-143
  |package module 1={{packages/sun microsystems/bga-521}}
  1 KB (171 words) - 16:32, 13 December 2017
• sun microsystems/ultrasparc/stp1030bga-167
  |package module 1={{packages/sun microsystems/bga-521}}
  1 KB (193 words) - 16:32, 13 December 2017
• sun microsystems/ultrasparc/stp1030bga-182
  |package module 1={{packages/sun microsystems/bga-521}}
  1 KB (167 words) - 16:32, 13 December 2017
• sun microsystems/ultrasparc/stp1030bga-200
  |package module 1={{packages/sun microsystems/bga-521}}
  1 KB (179 words) - 16:32, 13 December 2017
• intel/microarchitectures/cascade lake
  ...ging two extreme core count (XCC) dies together on the same substrate in a BGA package. The two dies are interconnected through 1 {{intel|UPI}} link which Cascade Lake AP uses a high-density high-performance ball grid array (BGA) package. It has 5,903 balls at a 0.99 mm pitch. There are two separate pow
  32 KB (4,535 words) - 12:12, 24 September 2024
• nervana/microarchitectures/spring crest
  ** BGA with 3,325 pins
  11 KB (1,646 words) - 13:35, 26 April 2020
• intel/cores/kaby lake g
  ...p solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to * BGA package
  5 KB (728 words) - 18:07, 12 July 2018
• intel/cores/skylake de
  All processors are a single-socket {{intel|BGA-2518}} package, manufacturing on Intel's [[14 nm process|14nm+ process]] ba
  6 KB (774 words) - 01:49, 25 February 2019

View (previous 20 | next 20) (20 | 50 | 100 | 250 | 500)