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Editing yield
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Where, | Where, | ||
− | * N<sub>good</sub> - number of working dies per wafer | + | * N<sub>good></sub> - number of working dies per wafer |
− | * N<sub> | + | * N<sub>good></sub> - number of dies per wafer |
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=== Measuring yield === | === Measuring yield === | ||
The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include: | The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include: | ||
− | * [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not | + | * [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scraped |
− | * [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not | + | * [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scraped |
* [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage | * [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage | ||
* [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]] | * [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]] | ||
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During a new process technology bring-up, yield loss can be very high (< 40% yield). The process of identifying yield losses, quantifying them, and improving them is referred to as [[yield learning]]. | During a new process technology bring-up, yield loss can be very high (< 40% yield). The process of identifying yield losses, quantifying them, and improving them is referred to as [[yield learning]]. | ||
− | == Yield modeling = | + | === Yield modeling === |
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{{empty section}} | {{empty section}} | ||
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