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|name=FSD Chip | |name=FSD Chip | ||
|image=tesla fsd chip (front).png | |image=tesla fsd chip (front).png | ||
− | |image | + | |image size=FSD Chip, front |
|designer=Tesla (car company) | |designer=Tesla (car company) | ||
|manufacturer=Samsung | |manufacturer=Samsung | ||
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|core count=12 | |core count=12 | ||
|thread count=12 | |thread count=12 | ||
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|package name 1=tesla_car,fcbga_2116 | |package name 1=tesla_car,fcbga_2116 | ||
}} | }} | ||
− | '''Full Self-Driving Chip''' ('''FSD Chip''', previously '''Autopilot Hardware 3.0''') is an [[autonomous driving chip]] designed by [[tesla car|Tesla]] and introduced in early [[2019 | + | '''Full Self-Driving Chip''' ('''FSD Chip''', previously '''Autopilot Hardware 3.0''') is an [[autonomous driving chip]] designed by [[tesla car|Tesla]] and announced and introduced in early [[2019]]. Fabricated on [[Samsung]]'s [[14 nm process technology]], this chip meets AEC-Q100 automotive quality standards. The FSD Chip incorporates 3 quad-core {{armh|Cortex-A72|l=arch}} clusters for a total of 12 CPUs operating at 2.2 GHz, a GPU operating 1 GHz, 2 [[neural processing units]] operating at 2 GHz, and various other hardware accelerators. The FSD supports up to octa-channel LPDDR4-4266 memory. |
== History == | == History == | ||
− | Design and planning for the FSD chip started in 2016 when Tesla claims they saw no alternative solution that fits their problem of addressing autonomous driving. The FSD chip project was led by | + | Design and planning for the FSD chip started in 2016 when Tesla claims they saw no alternative solution that fits their problem of addressing autonomous driving. The FSD chip project was led by Pete Bannon. The design team was formed in February 2016. Development was done over the course of 18 months. In August 2017, the chip was released for manufacturing with first silicon coming back in December 2017 fully working. A number of additional modifications were done to the design, requiring [[respinning]]. B0 [[stepping]] was released to manufacturing in April 2018. Full production of B0 started shortly after qualifications in July 2018. In December 2018, Tesla started retrofitting employee cars with the new hardware and software stack. In March 2019, Tesla began volume shipping the FSD chip and computer in their Model S and Model X cars. Production shipment in the Tesla Model 3 started in April 2019. |
== Overview == | == Overview == | ||
[[File:tesla fsd block diagram.svg|left|300px|thumb|Block Diagram]] | [[File:tesla fsd block diagram.svg|left|300px|thumb|Block Diagram]] | ||
− | The full self-driving chip or FSD chip for short is [[tesla car|Tesla's]] home-grown custom designed [[autonomous driving chip]]. The chip has been in development since [[2016]] and has entered mass production in early [[2019]]. Designed as a drop-in upgrade for Tesla's existing cars, the FSD chip inherits most of the power and thermal requirements of prior solutions | + | The full self-driving chip or FSD chip for short is [[tesla car|Tesla's]] home-grown custom designed [[autonomous driving chip]]. The chip has been in development since [[2016]] and has entered mass production in early [[2019]]. Designed as a drop-in upgrade for Tesla's existing cars, the FSD chip inherits most of the power and thermal requirements of prior solutions. Since the chip itself is designed specifically for Tesla's own cars and their own requirements, much of the general purpose-ability of alternative [[neural processors]] has been stripped away from the FSD chip, leaving the design with only the hardware they need. |
− | At a high level, the chip is a full | + | At a high level, the chip is a full system-on-a-chip capable of booting a standard operating system. It is manufactured on Samsung's own [[14-nanometer process]] at their Austin, Texas fab, packing roughly six billion transistors on a 260 millimeter squared silicon die. There are twelve {{arch|64}} [[ARM]] cores organized as three clusters of quad-core {{armh|Cortex-A72|l=arch}} cores operating at 2.2 GHz which are used for general purpose processing. There is also relatively light GPU primarily designed for light-weight post-processing. It operates at 1 GHz, capable of up to 600 GFLOPS, supporting both [[single-precision]] and [[double-precision]] floating point operations. |
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{{clear}} | {{clear}} | ||
=== Safety system=== | === Safety system=== | ||
− | There is a safety system that incorporates a dual-core [[lockstep]] CPU which conducts the final arbitration of the car actuators. This CPU determines if the two plans generated by the two FSD chips on the FSD computer match and if it's safe to drive the actuators | + | There is a safety system that incorporates a dual-core [[lockstep]] CPU which conducts the final arbitration of the car actuators. This CPU determines if the two plans generated by the two FSD chips on the FSD computer match and if it's safe to drive the actuators. |
=== Security system=== | === Security system=== | ||
− | The security system is designed to ensure the chip only executes code that has been cryptographically-signed by Tesla | + | The security system is designed to ensure the chip only executes code that has been cryptographically-signed by Tesla |
=== Camera serial interface === | === Camera serial interface === | ||
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=== Neural processing unit === | === Neural processing unit === | ||
− | The FSD chip integrates two custom-designed [[neural processing units]]. Each NPU packs 32 MiB of SRAM designed for storing temporary network results, reducing data movements to main memory. The overall design is pretty straightforward. Each cycle, 256 bytes of activation data and an additional 128 bytes of weight data is read from the SRAM into the MACs array where they are combined. Each NPU has a 96x96 [[ | + | The FSD chip integrates two custom-designed [[neural processing units]]. Each NPU packs 32 MiB of SRAM designed for storing temporary network results, reducing data movements to main memory. The overall design is pretty straightforward. Each cycle, 256 bytes of activation data and an additional 128 bytes of weight data is read from the SRAM into the MACs array where they are combined. Each NPU has a 96x96 [[multiplay-accumulate]] array for a total of 9,216 MACs and 18,432 operations. For the FSD chip, Tesla uses an 8-bit by 8-bit integer multiply and a 32-bit integer addition. The choices for both data types is largely driven by their effort to reduce the power consumption (e.g., a 32-bit FP addition consumes roughly 9 times as much as a 32-bit integer addition) Operating at 2 GHz, each NPU has a peak performance of 36.86 [[trillion operations per second]] (TOPS). With two NPUs on each chip, the FSD chip is capable of up to 73.7 trillion operations per second of combined peak performance. Following the dot product operation, data is shifted to the [[activation function|activation hardware]], the pooling hardware, and finally into the write buffer which aggregates the results. The FSD supports a number of activation functions, including a [[rectified linear unit]] (ReLU), [[Sigmoid Linear Unit]] (SiLU), and TanH. Each cycle, 128 bytes of result data is written back to the SRAM. All the operations are done simultaneously and continuously, repeating until the full network is done. |
<div> | <div> | ||
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* 2 x DMA operations for reading and writing to main memory | * 2 x DMA operations for reading and writing to main memory | ||
− | * 3x dot-product instructions (convolution, deconvolution, and | + | * 3x dot-product instructions (convolution, deconvolution, and innner-product) |
* scale (1-input, 1-output) | * scale (1-input, 1-output) | ||
* eltwise (2-input, 1-output) | * eltwise (2-input, 1-output) | ||
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|type=LPDDR4-4266 | |type=LPDDR4-4266 | ||
|ecc=Yes | |ecc=Yes | ||
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|controllers=1 | |controllers=1 | ||
+ | |channels=8 | ||
|width=128 bits | |width=128 bits | ||
|max bandwidth=63.58 GiB/s | |max bandwidth=63.58 GiB/s | ||
+ | |bandwidth schan=7.95 GiB/s | ||
+ | |bandwidth ochan=63.58 GiB/s | ||
}} | }} | ||
== Full self-driving computer (FSD Computer) == | == Full self-driving computer (FSD Computer) == | ||
− | The FSD computer is designed to be retrofitted into existing Tesla models and is therefore largely the same in terms of form factor and I/O. The computer itself fits just behind the glove compartment of the car. The FSD Computer can be installed by a technician in the same slot as the prior Autopilot Hardware 2.5 board. The board itself incorporates two fully independent FSD chips along with their own power subsystem, DRAM, and flash memory for full redundancy. Each chip boots up from its own storage memory and runs its own independent operating system. On the right of the board (shown below) are the eight camera connectors. The power supply and controls are on the left side of the board. The board sits on two independent power supplies - one for one of the FSD chips and one for the other. Additionally, half of the cameras sit on one power supply and the other half sit on the second power supply (note that the video input itself is received by both chips) | + | The FSD computer is designed to be retrofitted into existing Tesla models and is therefore largely the same in terms of form factor and I/O. The computer itself fits just behind the glove compartment of the car. The FSD Computer can be installed by a technician in the same slot as the prior Autopilot Hardware 2.5 board. The board itself incorporates two fully independent FSD chips along with their own power subsystem, DRAM, and flash memory for full redundancy. Each chip boots up from its own storage memory and runs its own independent operating system. On the right of the board (shown below) are the eight camera connectors. The power supply and controls are on the left side of the board. The board sits on two independent power supplies - one for one of the FSD chips and one for the other. Additionally, half of the cameras sit on one power supply and the other half sit on the second power supply (note that the video input itself is received by both chips). |
:[[File:tesla fsd computer board.png|600px]] | :[[File:tesla fsd computer board.png|600px]] | ||
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− | + | The computer itself intakes inputs from a variety of sources including current car readings such as acceleration and speed, radar, GPS, IMU, ultrasonic sensors, wheel ticks, steering angle, and maps data. Data is fed to both FSD chips simultaneously for processing. The two chips independently form a future plan for the car which is then consequently compared between the two chips to ensure an agreement was reached. Once the two plans from both chips agree on the calculated plan, the car can proceed and drive. The drive commands are then validated and sensory information is used as feedback for ensuring the commands executed the desired operations. | |
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== Die == | == Die == | ||
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:[[File:tesla fsd die (annotated).png|800px]] | :[[File:tesla fsd die (annotated).png|800px]] | ||
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* 36.864 trillion OPs | * 36.864 trillion OPs | ||
** 9,216 MACs @ 2 GHz | ** 9,216 MACs @ 2 GHz | ||
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:[[File:tesla fsd die bumps.png|800px]] | :[[File:tesla fsd die bumps.png|800px]] | ||
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== See also == | == See also == | ||
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== Bibliography == | == Bibliography == | ||
+ | * ''Tesla Autonomy Day'', Apr 22, 2019 | ||
* Tesla, ''personal communication'', April 25, 2019 | * Tesla, ''personal communication'', April 25, 2019 | ||
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Facts about "FSD Chip - Tesla"
base frequency | 2,200 MHz (2.2 GHz, 2,200,000 kHz) + |
core count | 12 + |
core name | Cortex-A72 + |
core stepping | B0 + |
designer | Tesla (car company) + |
die area | 260 mm² (0.403 in², 2.6 cm², 260,000,000 µm²) + |
die length | 20 mm (2 cm, 0.787 in, 20,000 µm) + |
die width | 13 mm (1.3 cm, 0.512 in, 13,000 µm) + |
first announced | April 22, 2019 + |
first launched | March 10, 2019 + |
full page name | tesla (car company)/fsd chip + |
has ecc memory support | true + |
instance of | microprocessor + |
isa | ARMv8.0-A + |
isa family | ARM + |
ldate | March 10, 2019 + |
main image | + |
manufacturer | Samsung + |
market segment | Automotive + |
max memory | 8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) + |
max memory bandwidth | 63.58 GiB/s (65,105.92 MiB/s, 68.269 GB/s, 68,268.505 MB/s, 0.0621 TiB/s, 0.0683 TB/s) + |
microarchitecture | Cortex-A72 + |
name | FSD Chip + |
package | FCBGA-2116 + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
supported memory type | LPDDR4-4266 + |
tdp | 36 W (36,000 mW, 0.0483 hp, 0.036 kW) + |
technology | CMOS + |
thread count | 12 + |
transistor count | 6,000,000,000 + |
word size | 64 bit (8 octets, 16 nibbles) + |