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|tstorage max=125 °C
 
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'''Helio P10''' ('''MT6755''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2016]]. This SoC, which incorporates eight {{armh|Cortex-A53|l=arch}} cores and is manufactured on [[TSMC]]'s [[28 nm process]], operates at up to 2 GHz and supports up to 4 GiB of single-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|Mali-T860}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 6.
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'''Helio P10''' ('''MT6755''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2016]]. This SoC, which incorporates eight {{armh|Cortex-A53|l=arch}} cores and is manufactured on [[TSMC]]'s [[28 nm process]], operates at up to 2 GHz and supports up to 4 GiB of single-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|Mali-T880}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
 
This processor is made of two independent clusters of {{armh|Cortex-A53|l=arch}} with four cores each linked together via a {{armh|CCI-400}}. The two clusters have a maximum operating frequency of 2 GHz and 1.2 GHz respectively.
 
This processor is made of two independent clusters of {{armh|Cortex-A53|l=arch}} with four cores each linked together via a {{armh|CCI-400}}. The two clusters have a maximum operating frequency of 2 GHz and 1.2 GHz respectively.
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* [[used by::iMan Victor]]
 
* [[used by::iMan Victor]]
 
* [[used by::Lenovo K5 Note]]
 
* [[used by::Lenovo K5 Note]]
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* [[used by::LG Stylus 3]]
 
 
* [[used by::Meizu M3E]]
 
* [[used by::Meizu M3E]]
 
* [[used by::Meizu M3 Max]]
 
* [[used by::Meizu M3 Max]]
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* [[used by::Meizu U20]]
 
* [[used by::Meizu U20]]
 
* [[used by::Nomu S30]]
 
* [[used by::Nomu S30]]
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* [[used by::Nokia 5.1]]
 
 
* [[used by::Oppo F1 Plus]]
 
* [[used by::Oppo F1 Plus]]
 
* [[used by::Oppo R9]]
 
* [[used by::Oppo R9]]
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* [[used by::Sony Xperia XA Ultra]]
 
* [[used by::Sony Xperia XA Ultra]]
 
* [[used by::TCL Flash Plus 2]]
 
* [[used by::TCL Flash Plus 2]]
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* [[used by::TP-Link Neffos X1]]
 
 
* [[used by::TP-Link Neffos X1 Max]]
 
* [[used by::TP-Link Neffos X1 Max]]
 
* [[used by::Ulefone Future]]
 
* [[used by::Ulefone Future]]
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* [[used by::Wolder WIAM #65]]
 
* [[used by::Wolder WIAM #65]]
 
* [[used by::ZTE Nubia N1]]
 
* [[used by::ZTE Nubia N1]]
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* [[used by:: Motorola Moto M]]
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* [[used by::Neffos X1]]
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* [[used by:: Gionee A1]]  
 
 
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Retrieved from "https://en.wikichip.org/wiki/mediatek/helio/mt6755"
Facts about "Helio P10 (MT6755) - MediaTek"
RDF feed
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,200 MHz (1.2 GHz, 1,200,000 kHz) +
bus typeAMBA 4 AXI +
core count8 +
core nameCortex-A53 +
core voltage1 V (10 dV, 100 cV, 1,000 mV) +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJune 1, 2015 +
first launchedJanuary 2016 +
full page namemediatek/helio/mt6755 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T860 +
integrated gpu base frequency700 MHz (0.7 GHz, 700,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units2 +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description16-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldateJanuary 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max junction temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth6.95 GiB/s (7,116.8 MiB/s, 7.463 GB/s, 7,462.506 MB/s, 0.00679 TiB/s, 0.00746 TB/s) +
max memory channels1 +
max operating temperature80 °C +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureCortex-A53 +
min operating temperature-20 °C +
min storage temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberP10 +
nameHelio P10 +
part numberMT6755 + and MTK6755 +
process28 nm (0.028 μm, 2.8e-5 mm) +
seriesHelio P +
smp max ways1 +
supported memory typeLPDDR3-1866 +
technologyCMOS +
thread count8 +
used byAlcatel Flash Plus 2 +, Archos Diamond 2 Plus +, Blackview BV6000 +, Blackview R7 +, BLU Pure XR +, BLU Vivo 6 +, Elephone M3 +, Elephone P9000 +, Gionee M6 Plus +, Gionee S8 +, HTC Desire 10 Pro +, iMan Victor +, Lenovo K5 Note +, Meizu M3E +, Meizu M3 Max +, Meizu M3 Note +, Meizu U20 +, Nomu S30 +, Oppo F1 Plus +, Oppo R9 +, Sony Xperia XA +, Sony Xperia XA Ultra +, TCL Flash Plus 2 +, TP-Link Neffos X1 Max +, Ulefone Future +, UMI Max +, UMI Plus +, UMI Super +, Wolder WIAM #65 +, ZTE Nubia N1 +, HTC U Play +, HTC One A9s +, TP-Link Neffos X1 +, Motorola Moto M +, Gionee A1 +, Nokia 5.1 + and LG Stylus 3 +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +