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{{intel title|Xeon Platinum 8176F}} | {{intel title|Xeon Platinum 8176F}} | ||
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|name=Xeon Platinum 8176F | |name=Xeon Platinum 8176F | ||
|image=skylake-sp (hfi).png | |image=skylake-sp (hfi).png | ||
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|manufacturer=Intel | |manufacturer=Intel | ||
|model number=8176F | |model number=8176F | ||
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|market=Server | |market=Server | ||
|first announced=July 11, 2017 | |first announced=July 11, 2017 | ||
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|isa=x86-64 | |isa=x86-64 | ||
|isa family=x86 | |isa family=x86 | ||
− | |microarch=Skylake | + | |microarch=Skylake |
|platform=Purley | |platform=Purley | ||
|chipset=Lewisburg | |chipset=Lewisburg | ||
|core name=Skylake SP | |core name=Skylake SP | ||
|core family=6 | |core family=6 | ||
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|process=14 nm | |process=14 nm | ||
|technology=CMOS | |technology=CMOS | ||
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|core count=28 | |core count=28 | ||
|thread count=56 | |thread count=56 | ||
+ | |max cpus=8 | ||
|max memory=768 GiB | |max memory=768 GiB | ||
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|tdp=173 W | |tdp=173 W | ||
|tcase min=0 °C | |tcase min=0 °C | ||
|tcase max=87 °C | |tcase max=87 °C | ||
− | + | |package module 1={{packages/intel/fclga-3647}} | |
− | |package | ||
}} | }} | ||
− | '''Xeon Platinum 8176F''' is a {{arch|64}} [[28-core]] [[x86]] multi-socket highest performance server microprocessor introduced by [[Intel]] in mid-2017. This chip supports up to 8-way multiprocessing. The Platinum 8176F, which is based on the server configuration of the {{intel | + | '''Xeon Platinum 8176F''' is a {{arch|64}} [[28-core]] [[x86]] multi-socket highest performance server microprocessor introduced by [[Intel]] in mid-2017. This chip supports up to 8-way multiprocessing. The Platinum 8176F, which is based on the server configuration of the {{intel|Skylake|l=arch}} microarchitecture and is manufactured on a [[14 nm process|14 nm+ process]], sports 2 {{x86|AVX-512}} [[FMA]] units as well as three {{intel|Ultra Path Interconnect}} links. This microprocessor, which operates at 2.1 GHz with a TDP of 173 W and a {{intel|turbo boost}} frequency of up to 3.8 GHz, supports up 768 GiB of hexa-channel DDR4-2666 ECC memory. |
This specific model incorporates the {{intel|Omni-Path}} Host Fabric Interface (HFI) die in the same package as the processor. | This specific model incorporates the {{intel|Omni-Path}} Host Fabric Interface (HFI) die in the same package as the processor. | ||
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== Cache == | == Cache == | ||
− | {{main|intel/microarchitectures/ | + | {{main|intel/microarchitectures/skylake#Memory_Hierarchy|l1=Skylake § Cache}} |
{{cache size | {{cache size | ||
|l1 cache=1.75 MiB | |l1 cache=1.75 MiB | ||
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|xfr=No | |xfr=No | ||
}} | }} | ||
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Facts about "Xeon Platinum 8176F - Intel"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Xeon Platinum 8176F - Intel#io + |
base frequency | 2,100 MHz (2.1 GHz, 2,100,000 kHz) + |
chipset | Lewisburg + |
clock multiplier | 21 + |
core count | 28 + |
core family | 6 + |
core name | Skylake SP + |
core stepping | H0 + |
designer | Intel + |
family | Xeon Platinum + |
first announced | July 11, 2017 + |
first launched | July 11, 2017 + |
full page name | intel/xeon platinum/8176f + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has advanced vector extensions 512 | true + |
has ecc memory support | true + |
has extended page tables support | true + |
has feature | Advanced Encryption Standard Instruction Set Extension +, Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Vector Extensions 512 +, Enhanced SpeedStep Technology +, Extended Page Tables +, Hyper-Threading Technology +, Intel VT-d +, Intel VT-x +, Intel vPro Technology +, Speed Shift Technology +, Transactional Synchronization Extensions +, Trusted Execution Technology + and Turbo Boost Technology 2.0 + |
has intel enhanced speedstep technology | true + |
has intel speed shift technology | true + |
has intel trusted execution technology | true + |
has intel turbo boost technology 2 0 | true + |
has intel vpro technology | true + |
has intel vt-d technology | true + |
has intel vt-x technology | true + |
has second level address translation support | true + |
has simultaneous multithreading | true + |
has transactional synchronization extensions | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 1,792 KiB (1,835,008 B, 1.75 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 896 KiB (917,504 B, 0.875 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 896 KiB (917,504 B, 0.875 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 28 MiB (28,672 KiB, 29,360,128 B, 0.0273 GiB) + |
l3$ description | 11-way set associative + |
l3$ size | 38.5 MiB (39,424 KiB, 40,370,176 B, 0.0376 GiB) + |
ldate | July 11, 2017 + |
main image | + |
manufacturer | Intel + |
market segment | Server + |
max case temperature | 360.15 K (87 °C, 188.6 °F, 648.27 °R) + |
max cpu count | 8 + |
max memory | 786,432 MiB (805,306,368 KiB, 824,633,720,832 B, 768 GiB, 0.75 TiB) + |
max memory bandwidth | 119.21 GiB/s (122,071.04 MiB/s, 128.001 GB/s, 128,000.763 MB/s, 0.116 TiB/s, 0.128 TB/s) + |
max memory channels | 6 + |
max pcie lanes | 48 + |
microarchitecture | Skylake (server) + |
min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
min dts temperature | 0 °C + |
model number | 8176F + |
name | Xeon Platinum 8176F + |
package | FCLGA-3647 + |
platform | Purley + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
s-spec (qs) | QNC8 + |
series | 8000 + |
smp interconnect | UPI + |
smp interconnect links | 3 + |
smp interconnect rate | 10.4 GT/s + |
smp max ways | 8 + |
socket | LGA-3647 + and Socket P + |
supported memory type | DDR4-2666 + |
tdp | 173 W (173,000 mW, 0.232 hp, 0.173 kW) + |
technology | CMOS + |
thread count | 56 + |
turbo frequency (1 core) | 3,800 MHz (3.8 GHz, 3,800,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |